B81C 2201/0159
Lithographic techniques not provided for in b81c2201/0157
Official title: Lithographic techniques not provided for in B81C2201/0157
B81C2201/0159 (Lithographic techniques not provided for in b81c2201/0157) appears on 74 US grants and 94 published applications in this corpus.
Search patents in B81C- Granted patents
- 74
- Published applications
- 94
- Assignees
- 83
- Inventors
- 218
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 3 |
| 2005 | 1 | 4 |
| 2006 | 2 | 3 |
| 2007 | 2 | 3 |
| 2008 | 1 | 2 |
| 2009 | 1 | 3 |
| 2010 | 5 | 7 |
| 2011 | 0 | 4 |
| 2012 | 3 | 0 |
| 2013 | 3 | 4 |
| 2014 | 3 | 3 |
| 2015 | 3 | 3 |
| 2016 | 2 | 7 |
| 2017 | 7 | 7 |
| 2018 | 6 | 1 |
| 2019 | 3 | 3 |
| 2020 | 3 | 5 |
| 2021 | 4 | 4 |
| 2022 | 2 | 5 |
| 2023 | 3 | 7 |
| 2024 | 4 | 4 |
| 2025 | 4 | 6 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical systems and preparation method thereof25 Aug 2026US 12,715,762 B2Huawei Technologies Co., Ltd.
- MEMS sensor package and its manufacturing method21 Apr 2026US 12,606,431 B2TDK Corporation
- MEMS and NEMS structures13 Jan 2026US 12,522,498 B2Obsidian Sensors, Inc.
- Systems and methods for fabricating microstructures23 Dec 2025US 12,504,642 B2MicroTau IP Pty Lted
- Method and system for fabricating a MEMS device cap11 Nov 2025US 12,466,726 B2InvenSense, Inc.
- Inertia measurement unit and method for forming the same28 May 2026US 2026/0145931 A1AAC Technologies PTE.Ltd.
- Mems and nems structures23 Apr 2026US 2026/0109596 A1Obsidian Sensors, Inc.
- Method for attaching a bridging metal layer in via holes for supporting posts19 Feb 2026US 2026/0048982 A1National Chung Shan Institute of Science and Technology
- Method and system for fabricating a mems device cap11 Dec 2025US 2025/0376371 A1InvenSense, Inc.
- Microchannel chip and method for producing the same6 Nov 2025US 2025/0339854 A1Toppan Holdings Inc.
Most cited
By later US patents
- Decal transfer lithography220US 7,662,545 B2The Board of Trustees of the University of Illinois · 2010
- Formation of microstructures using a preformed photoresist sheet144US 5,378,583 AWisconsin Alumni Research Foundation · 1995
- Microstructure synthesis by flow lithography and polymerization115US 7,709,544 B2Massachusetts Institute of Technology · 2010
- Gradient structures interfacing microfluidics and nanofluidics, methods for fabrication and uses thereof107US 7,217,562 B2Princeton University · 2007
- Formation of microstructures using a preformed photoresist sheet80US 5,576,147 AWisconsin Alumni Research Foundation · 1996