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US 12,606,431 B2Granted
MEMS sensor package and its manufacturing method
AssigneeTDK Corporation
InventorToyotaka Kobayashi
Life of this patent
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Abstract
Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern.
Claims14
A MEMS sensor package comprising:
- a substrate;
- an annular-shaped first dry film pattern stuck to one surface of the substrate;
- and
- a MEMS sensor chip including a support having a tubular shape and a detection part which is supported on the support so as to overlap a cavity of the support,
- wherein the MEMS sensor chip is fixed to the substrate by an adhesion of an annular mounting surface of the support to the first dry film pattern.
2 more elements
A method for manufacturing a MEMS sensor package, the method comprising:
- sticking a photosensitive dry film resist on one surface of a substrate;
- exposing and developing the photosensitive dry film resist to form an annular-shaped first dry film pattern;
- preparing a MEMS sensor chip including a support having a tubular shape and a detection part which is supported on the support so as to overlap a cavity of the support and sticking an annular mounting surface of the support to the first dry film pattern, and then
- curing the first dry film pattern.
1 more element
A MEMS sensor package comprising:
- a substrate including a plurality of insulating layers and a plurality of conductive layers stacked alternately, the substrate having a through hole;
- a dry film pattern stuck to an uppermost one of the plurality of insulating layers such that the dry film pattern surrounds the through hole of the substrate;
- and
- a MEMS sensor chip including a support having a tubular shape and a detection part provided on a top surface of the support,
- wherein the MEMS sensor chip is fixed to the substrate by sticking a bottom surface of the support to the dry film pattern such that a top surface of the dry film pattern is stuck to the bottom surface of the support and a bottom surface of the dry film pattern is stuck to the uppermost one of the plurality of insulating layers.
2 more elements
Dependencies are inferred from the claim text.