B81C 1/00095
Interconnects
Official title: {Interconnects}
B81C1/00095 (Interconnects) appears on 144 US grants and 181 published applications in this corpus.
Search patents in B81C- Granted patents
- 144
- Published applications
- 181
- Assignees
- 109
- Inventors
- 389
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 2 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 3 | 4 |
| 2005 | 1 | 3 |
| 2006 | 3 | 3 |
| 2007 | 1 | 5 |
| 2008 | 4 | 13 |
| 2009 | 8 | 8 |
| 2010 | 4 | 9 |
| 2011 | 8 | 5 |
| 2012 | 9 | 9 |
| 2013 | 8 | 8 |
| 2014 | 8 | 9 |
| 2015 | 9 | 13 |
| 2016 | 8 | 7 |
| 2017 | 8 | 6 |
| 2018 | 6 | 8 |
| 2019 | 6 | 9 |
| 2020 | 8 | 11 |
| 2021 | 11 | 14 |
| 2022 | 12 | 11 |
| 2023 | 7 | 4 |
| 2024 | 4 | 7 |
| 2025 | 4 | 8 |
| 2026 | 4 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Crossovers for vacuum packaging4 Aug 2026US 12,698,202 B2Obsidian Sensors, Inc.
- MEMS with over-voltage protection12 May 2026US 12,623,900 B1SiTime Corporation
- Self-aligned acoustic hole formation in piezoelectrical MEMS microphone17 Feb 2026US 12,552,664 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Foundry-compatible through silicon via process for integrated micro-speaker and microphone6 Jan 2026US 12,515,943 B2Vibrant Microsystems Inc.
- Digital assembly of spherical hydrogel voxels to form 3D lattice structures16 Dec 2025US 12,496,767 B2University of Virginia
- Method for producing a silicon layer system with electrical connections27 Aug 2026US 2026/0250122 A1
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical system device with filled via12 Mar 2026US 2026/0070778 A1
- Molded fluidic integrated circuit dies with embedded via structures25 Dec 2025US 2025/0388461 A1Hewlett-Packard Development Company, L. P.
- Self-aligned acoustic hole formation in piezoelectrical mems microphone30 Oct 2025US 2025/0333297 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Sub-lithographic nano interconnect structures, and method for forming same102US 7,553,760 B2International Business Machines Corporation · 2009
- Electronic component having micro-electrical mechanical system100US 7,053,456 B2Kabushiki Kaisha Toshiba · 2006
- Microelectronic assembly from processed substrate71US 11,367,652 B2Invensas Bonding Technologies, Inc. · 2022
- Hermetic packaging and method of manufacture and use therefore60US 7,579,663 B22009
- Hermetically sealing using a cold welded tongue and groove structure46US 8,191,756 B2MicroCHIPS, Inc. · 2012