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US 2025/0388461 A1Published application
Molded fluidic integrated circuit dies with embedded via structures
AssigneeHewlett-Packard Development Company, L.P.
InventorsBo Song, Chien-Hua Chen, Fan Wu
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Abstract
A structure includes a molded structure, an integrated circuit (IC) die molded into the molded structure, the IC die including one of a fluidic channel or a sensor, an interposer structure molded into the molded structure, and a via structure embedded within the interposer structure, the via structure fluidically or electrically connecting a top surface of the interposer structure to a bottom surface of the interposer structure.
Claims20
A structure, comprising:
- a molded structure;
- an integrated circuit (IC) die molded into the molded structure, the IC die including one of a fluidic channel or a sensor;
- an interposer structure molded into the molded structure;
- and
- a via structure embedded within the interposer structure, the via structure fluidically or electrically connecting a top surface of the interposer structure to a bottom surface of the interposer structure.
2 more elements
A structure, comprising:
- a molded structure;
- a fluidic integrated circuit (IC) die molded into the molded structure;
- an interposer structure molded into the molded structure and arranged parallel to the fluidic IC die;
- and
- a via structure separated from the fluidic IC die by the interposer structure, the via structure including one of a fluidic channel or an electrical routing structure.
2 more elements
A method, comprising:
- providing a fluidic integrated circuit (IC) die on a carrier;
- providing an interposer structure on the carrier;
- depositing mold material over the fluidic IC die and the interposer structure to form a molded structure;
- removing the carrier;
- and
- forming a via structure within the interposer structure to fluidically or electrically connect a top surface of the interposer structure to a bottom surface of the interposer structure.
3 more elements
Dependencies are inferred from the claim text.