B81B 2203/033
Trenches
B81B2203/033 (Trenches) appears on 191 US grants and 234 published applications in this corpus.
Search patents in B81B- Granted patents
- 191
- Published applications
- 234
- Assignees
- 128
- Inventors
- 549
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 2 |
| 2002 | 6 | 8 |
| 2003 | 3 | 8 |
| 2004 | 8 | 11 |
| 2005 | 7 | 5 |
| 2006 | 4 | 14 |
| 2007 | 3 | 6 |
| 2008 | 3 | 4 |
| 2009 | 6 | 4 |
| 2010 | 6 | 5 |
| 2011 | 9 | 6 |
| 2012 | 1 | 7 |
| 2013 | 5 | 5 |
| 2014 | 8 | 8 |
| 2015 | 9 | 8 |
| 2016 | 4 | 2 |
| 2017 | 11 | 11 |
| 2018 | 2 | 9 |
| 2019 | 8 | 7 |
| 2020 | 8 | 20 |
| 2021 | 15 | 15 |
| 2022 | 10 | 16 |
| 2023 | 7 | 15 |
| 2024 | 14 | 19 |
| 2025 | 14 | 11 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Micro-acoustic resonator springy anchor based on offset acoustic reflector trenches21 Jul 2026US 12,686,611 B2Texas Instruments Incorporated
- Micro-electro-mechanical system package and fabrication method thereof14 Jul 2026US 12,679,722 B2Vanguard International Semiconductor Corporation
- Biomaterial detection sensor and method of manufacturing the same19 May 2026US 12,631,572 B2Samsung Electronics Co., Ltd.
- Microfluidic chip31 Mar 2026US 12,589,393 B2Boe Technology Group Co., Ltd.
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
- Device and method for manufacturing solid fuel microthrusters using only pcb-mems technology10 Sep 2026US 2026/0264889 A1Universidad de Sevilla
- Method for producing a micromechanical layer structure with high aspect ratio and micromechanical layer structure21 May 2026US 2026/0138867 A1
- MEMS Resonator with Co-packaged Thermistor19 Feb 2026US 2026/0048981 A1Stathera IP Holdings Inc.
- Mems sensor arrangement and method for manufacturing a mems sensor arrangement5 Feb 2026US 2026/0035236 A1Infineon Technologies AG
Most cited
By later US patents
- Method for forming micro cavity560US 6,342,427 B12002
- Trench isolation for micromechanical devices92US 6,239,473 B1Cornell Research Foundation, Inc. · 2001
- Microfabricated structures with electrical isolation and interconnections85US 6,291,875 B1Analog Devices IMI, Inc. · 2001
- Microfabricated high aspect ratio device with an electrical isolation trench83US 6,121,552 AThe Regents of the University of Caliofornia · 2000
- Micromechanical component including function components suspended movably above a substrate73US 6,686,638 B2Robert Bosch GmbH · 2004