Microfabricated high aspect ratio device with an electrical isolation trench
AssigneeThe Regents of the University of Caliofornia
InventorsTimothy J. Brosnihan, James Bustillo, William A. Clark
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Abstract
A microfabricated device having a high vertical aspect ratio and electrical isolation between a structure region and a circuit region. The device may be fabricated on a single substrate and may include electrical interconnections between the structure region and the circuit region. The device includes a substrate and an isolation trench surrounding a structure region in the substrate. The isolation trench includes a lining of a dielectric insulative material. A plurality of electromechanical elements are located in the structure region and are laterally anchored to the isolation trench.
Claims19
A microfabricated device, comprising:
- a substrate having a device layer;
- an isolation trench extending through the device layer and electrically isolating a first region of the substrate from a second region of the substrate, the isolation trench including a lining of a dielectric insulative material;
- and
- a plurality of electromechanical or mechanical microstructure elements formed from the device layer in the first region and laterally anchored to the isolation trench.
A microfabricated device, comprising:
- a substrate having a device layer;
- an isolation trench extending through the device layer and electrically isolating a first region of the substrate from a second region of the substrate, the isolation trench including a lining of a dielectric insulative material;
- and
- a plurality of electromechanical or mechanical microstructure elements formed from the device layer in the first region and laterally anchored to the isolation trench and separated from each other by gaps.
A microfabricated device, comprising:
- a substrate having a device layer;
- an isolation trench extending through the device layer and electrically isolating a first region of the substrate from a second region of the substrate, the isolation trench including a lining of a dielectric insulative material;
- a cavity formed in a surface of the first region of the substrate;
- and
- a mechanical or electromechanical microstructure element formed from the device layer in the first region, the microstructure element including a first stationary portion laterally anchored to the isolation trench and a second movable portion extending into the cavity.
A microfabricated device, comprising:
- a substrate having a device layer;
- an isolation trench extending through the device layer and electrically isolating a first region of the substrate from a second region of the substrate, the isolation trench including a lining of a dielectric insulative material;
- a cavity formed in a surface of the first region of the device layer proximate to the isolation trench;
- and
- a mechanical or electromechanical microstructure element formed from the device layer in the first region, the microstructure element laterally anchored to the isolation trench and projecting into the cavity.
A microfabricated device, comprising:
- a substrate having a device layer with a first region and a second region;
- an isolation trench extending through the device layer along a border between the first region and the second region to electrically isolate the first region from the second region, the isolation trench including a lining of a dielectric insulative material;
- and
- an electromechanical or mechanical microstructure element formed from the device layer in the first region and laterally anchored to the isolation trench.
Dependencies are inferred from the claim text.