B28D 5/0058
Accessories specially adapted for use with machines for fine working of gems
Official title: {Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material (B28D5/0005, B28D5/024 take precedence)}
B28D5/0058 (Accessories specially adapted for use with machines for fine working of gems) appears on 639 US grants and 593 published applications in this corpus.
Search patents in B28D- Granted patents
- 639
- Published applications
- 593
- Assignees
- 333
- Inventors
- 1,385
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 13 | 0 |
| 1988 | 7 | 0 |
| 1989 | 6 | 0 |
| 1990 | 11 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 14 | 0 |
| 1999 | 25 | 0 |
| 2000 | 36 | 0 |
| 2001 | 33 | 11 |
| 2002 | 36 | 25 |
| 2003 | 17 | 17 |
| 2004 | 23 | 25 |
| 2005 | 14 | 18 |
| 2006 | 16 | 17 |
| 2007 | 15 | 25 |
| 2008 | 7 | 24 |
| 2009 | 10 | 20 |
| 2010 | 9 | 32 |
| 2011 | 21 | 35 |
| 2012 | 22 | 37 |
| 2013 | 20 | 26 |
| 2014 | 15 | 18 |
| 2015 | 23 | 21 |
| 2016 | 14 | 11 |
| 2017 | 14 | 16 |
| 2018 | 10 | 22 |
| 2019 | 16 | 26 |
| 2020 | 17 | 22 |
| 2021 | 18 | 27 |
| 2022 | 19 | 29 |
| 2023 | 13 | 27 |
| 2024 | 21 | 22 |
| 2025 | 26 | 30 |
| 2026 | 17 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Manufacturing method of gallium nitride substrate22 Sep 2026US 12,741,340 B2Disco Corporation
- Systems and methods for controlling surface profiles of wafers sliced in a wire saw22 Sep 2026US 12,741,397 B2GlobalWafers Co., Ltd.
- Methods for compensating for crystal structure differential material removal rates in sub-aperture figuring processes28 Jul 2026US 12,691,548 B2Corning Incorporated
- Cutting apparatus, tray, and transport system30 Jun 2026US 12,672,506 B2Disco Corporation
- ASC process automation device16 Jun 2026US 12,660,548 B2SK Siltron Co., Ltd.
- Method for simultaneously slicing a multiplicity of slices from a workpiece by means of a wire saw1 Oct 2026US 2026/0295901 A1
- Monocrystalline SiC Substrates Having an Asymmetrical Geometry and Method of Producing Same27 Aug 2026US 2026/0255640 A1SiCrystal GmbH
- Band saw cutting machine20 Aug 2026US 2026/0241610 A1Nachi-Fujikoshi Corp.
- Laser-assisted method for parting crystalline material6 Aug 2026US 2026/0225180 A1Wolfspeed, Inc.
- Cutting apparatus, cutting method, and method for manufacturing cut product30 Jul 2026US 2026/0216919 A1Towa Corporation
Most cited
By later US patents
- Multi-wafer slicing with a fixed abrasive200US 4,646,710 ACrystal Systems, Inc. · 1987
- Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece174US 6,295,977 B1Wacker Chemie AG · 2001
- Laser cutting apparatus and method154US 6,407,360 B1Samsung Electronics Co., Ltd. · 2002
- Laser beam processing machine124US 6,998,571 B2Disco Corporation · 2006
- Method and apparatus for targetless wafer alignment123US 4,328,553 AComputervision Corporation · 1982