B28D 5/007
Use, recovery or regeneration of abrasive mediums
Official title: {Use, recovery or regeneration of abrasive mediums (for grinding and polishing in general B24B57/00)}
B28D5/007 (Use, recovery or regeneration of abrasive mediums) appears on 96 US grants and 96 published applications in this corpus.
Search patents in B28D- Granted patents
- 96
- Published applications
- 96
- Assignees
- 70
- Inventors
- 218
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 4 |
| 2002 | 5 | 1 |
| 2003 | 3 | 2 |
| 2004 | 5 | 3 |
| 2005 | 2 | 1 |
| 2006 | 2 | 4 |
| 2007 | 4 | 6 |
| 2008 | 3 | 5 |
| 2009 | 1 | 5 |
| 2010 | 2 | 14 |
| 2011 | 5 | 10 |
| 2012 | 6 | 8 |
| 2013 | 9 | 7 |
| 2014 | 1 | 2 |
| 2015 | 5 | 4 |
| 2016 | 3 | 1 |
| 2017 | 2 | 3 |
| 2018 | 1 | 5 |
| 2019 | 4 | 1 |
| 2020 | 2 | 2 |
| 2021 | 1 | 2 |
| 2022 | 2 | 4 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 4 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for removing silicon powder in coolant for monocrystalline silicon slicing with diamond wire10 Mar 2026US 12,569,784 B2Tcl Zhonghuan Renewable Energy Technology Co., Ltd.
- Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon25 Nov 2025US 12,479,128 B2Siltronic AG
- Cutting method and cutting device5 Aug 2025US 12,377,579 B2Akita Prefecture
- Variable-step-distance micro-milling repair cutter path generating method for damage points on surface of optical crystal14 Jan 2025US 12,194,657 B2Harbin Institute of Technology
- Treatment process for recycling silicon ingot cutting waste14 Jan 2025US 12,195,342 B2Rosi
- Method for removing silicon powder in coolant for monocrystalline silicon slicing with diamond wire30 Jan 2025US 2025/0032959 A1Tcl Zhonghuan Renewable Energy Technology Co., Ltd.
- Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon25 Jul 2024US 2024/0246260 A1Siltronic AG
- Variable-step-distance micro-milling repair cutter path generating method for damage points on surface of optical crystal19 May 2022US 2022/0152873 A1Harbin Institute of Technology
- Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon10 Feb 2022US 2022/0040882 A1Siltronic AG
- Crystal ingot cutting device and crystal ingot cutting method27 Jan 2022US 2022/0024073 A1GlobalWafers Co., Ltd.
Most cited
By later US patents
- Method and apparatus for cutting rare earth alloy62US 6,443,143 B1Sumitomo Special Metals Co., Ltd. · 2002
- Method and apparatus for improved wire saw slurry48US 6,113,473 AG.T. Equipment Technologies, Inc. · 2000
- Brittle material cutting method46US 5,201,305 ANippei Toyama Corporation · 1993
- Slurry managing system and slurry managing method for wire saws42US 5,799,643 A1998
- Wire saw and slicing method using the same39US 5,269,285 AShin-Etsu Handotai Co., Ltd. · 1993