Crystal ingot cutting device and crystal ingot cutting method
AssigneeGlobalWafers Co., Ltd.
InventorChing-Shan Lin
Life of this patent
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Abstract
A crystal ingot cutting device and a crystal ingot cutting method are provided. The crystal ingot cutting device includes a driving unit, at least one cutting wire and a plurality of abrasive particles. The cutting wire is connected to the driving unit, wherein the driving unit drives a crystal ingot to move to the cutting wire and drives the cutting wire to reciprocate. A moving speed of the crystal ingot is 10˜700 μm/min, and a reciprocating speed of the cutting wire is 1800˜5000 m/min. The plurality of abrasive particles are arranged on the cutting wire, and a particle size of each abrasive particle is 5˜50 μm.
Claims10
A crystal ingot cutting device, comprising:
- a driving unit;
- at least one cutting wire connected to the driving unit, wherein the driving unit drives a crystal ingot to move to the at least one cutting wire and drives the at least one cutting wire to reciprocate, a moving speed of the crystal ingot is 10˜700 μm/min, a reciprocating speed of the at least one cutting wire is 1800˜5000 m/min;
- and
- a plurality of abrasive particles arranged on the at least one cutting wire, wherein a particle size of each of the plurality of abrasive particles is 5˜50 μm.
A crystal ingot cutting method, comprising:
- driving a crystal ingot to move to at least one cutting wire, wherein a moving speed of the crystal ingot is 10˜700 μm/min;
- and
- driving the at least one cutting wire to reciprocate to cut the crystal ingot by a plurality of abrasive particles on the at least one cutting wire, wherein a reciprocating speed of the at least one cutting wire is 1800˜5000 m/min,
- wherein a particle size of each of the plurality of abrasive particles is 5˜50 μm.
Dependencies are inferred from the claim text.