B28D 5/00
Fine working of gems, jewels, crystals
Official title: Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor (working by grinding or polishing B24; for artistic purposes B44B)
B28D5/00 (Fine working of gems, jewels, crystals) appears on 1,733 US grants and 1,715 published applications in this corpus.
Search patents in B28D- Granted patents
- 1,733
- Published applications
- 1,715
- Assignees
- 682
- Inventors
- 3,374
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 11 | 0 |
| 1979 | 13 | 0 |
| 1980 | 20 | 0 |
| 1981 | 10 | 0 |
| 1982 | 13 | 0 |
| 1983 | 7 | 0 |
| 1984 | 10 | 0 |
| 1985 | 14 | 0 |
| 1986 | 11 | 0 |
| 1987 | 16 | 0 |
| 1988 | 12 | 0 |
| 1989 | 12 | 0 |
| 1990 | 25 | 0 |
| 1991 | 13 | 0 |
| 1992 | 16 | 0 |
| 1993 | 17 | 0 |
| 1994 | 18 | 0 |
| 1995 | 21 | 0 |
| 1996 | 14 | 0 |
| 1997 | 10 | 0 |
| 1998 | 37 | 0 |
| 1999 | 46 | 0 |
| 2000 | 59 | 0 |
| 2001 | 54 | 25 |
| 2002 | 66 | 46 |
| 2003 | 41 | 50 |
| 2004 | 44 | 52 |
| 2005 | 31 | 64 |
| 2006 | 33 | 66 |
| 2007 | 26 | 84 |
| 2008 | 28 | 57 |
| 2009 | 39 | 70 |
| 2010 | 50 | 84 |
| 2011 | 46 | 77 |
| 2012 | 57 | 83 |
| 2013 | 59 | 82 |
| 2014 | 62 | 73 |
| 2015 | 59 | 88 |
| 2016 | 65 | 95 |
| 2017 | 70 | 58 |
| 2018 | 52 | 79 |
| 2019 | 61 | 77 |
| 2020 | 61 | 68 |
| 2021 | 57 | 80 |
| 2022 | 53 | 60 |
| 2023 | 45 | 63 |
| 2024 | 50 | 52 |
| 2025 | 52 | 53 |
| 2026 | 33 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B28D 5/0058Accessories specially adapted for use with machines for fine working of gems639
- B28D 5/0005Fine working of gems, jewels, crystals: by breaking533
- B28D 5/04Fine working of gems, jewels, crystals: by tools other than rotary type417
- B28D 5/02Fine working of gems, jewels, crystals: by rotary tools412
Recent patents
- Manufacturing method of gallium nitride substrate22 Sep 2026US 12,741,340 B2Disco Corporation
- Method for producing a detachment region in a solid-state body22 Sep 2026US 12,741,341 B2Siltectra GmbH
- Systems and methods for controlling surface profiles of wafers sliced in a wire saw22 Sep 2026US 12,741,397 B2GlobalWafers Co., Ltd.
- Processing apparatus, and installing method of processing tool of processing apparatus15 Sep 2026US 12,734,631 B2Tokyo Electron Limited
- Indium phosphide substrate and method for producing indium phosphide substrate15 Sep 2026US 12,740,431 B2JX Advanced Metals Corporation
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Method for simultaneously slicing a multiplicity of slices from a workpiece by means of a wire saw1 Oct 2026US 2026/0295901 A1
- Monocrystalline SiC Substrates Having an Asymmetrical Geometry and Method of Producing Same27 Aug 2026US 2026/0255640 A1SiCrystal GmbH
- Band saw cutting machine20 Aug 2026US 2026/0241610 A1Nachi-Fujikoshi Corp.
Most cited
By later US patents
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- Process for producing semiconductor article392US 6,534,382 B1Canon Kabushiki Kaisha · 2003
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- Method for sawing wafers employing multiple indexing techniques for multiple die dimensions289US 6,578,458 B1Micron Technology, Inc. · 2003
- Process for producing semiconductor article254US 6,100,166 ACanon Kabushiki Kaisha · 2000