Systems and methods for controlling surface profiles of wafers sliced in a wire saw
AssigneeGlobalWafers Co., Ltd.
InventorsSumeet S. Bhagavat, Carlo Zavattari, Peter D. Albrecht, William L. Luter
Life of this patent
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Abstract
Systems and methods for controlling the surface profiles of wafers sliced in a wire saw machine. The systems and methods are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered for example by changing the temperature of a temperature-controlling fluid circulated in fluid communication with side walls attached to a fixed bearing sidewall of the wire saw.
Claims15
A system for controlling the surface profile of wafers sliced from an ingot in a wire saw comprising:
- a wire saw frame including:
- a fixed bearing sidewall;
- a free bearing sidewall opposite the fixed bearing sidewall;
- and
- one or more bearings connected to the fixed bearing sidewall;
- a wire guide assembly for supporting wires, the wire guide assembly including wire guides having a first end rotatably connected to the one or more bearings and a second end supported by the free bearing sidewall, wherein the second ends of the wire guides are movable relative to the free bearing sidewall, wherein thermal deformation of the fixed bearing sidewall from a first state to a second state corresponds to a change in displacement of the one or more bearings and a change in a cutting surface profile of a cut wafer from a first cutting surface profile to a second cutting surface profile;
- a temperature regulation system attached to the fixed bearing sidewall for controlling thermal deformation of the fixed bearing sidewall, wherein controlling thermal deformation of the fixed bearing sidewall controls displacement of the one or more bearings;
- a control system for controlling the temperature of the fixed bearing sidewall including a temperature sensor for measuring the temperature of the fixed bearing sidewall;
- and
- a processor connected to the temperature regulation system and the control system, the processor configured to control the temperature of the fixed bearing sidewall at a desired temperature by activating the temperature regulation system.
A system for controlling a cutting surface profile of wafers cut from an ingot by a wire saw, the system comprising:
- a temperature regulation system attached to a fixed bearing sidewall of a wire saw frame for controlling thermal deformation of the fixed bearing sidewall, wherein controlling thermal deformation of the fixed bearing sidewall controls displacement of one or more bearings connected to the fixed bearing sidewall and a change in a cutting surface profile of a cut wafer;
- a control system for controlling the temperature of the fixed bearing sidewall including a temperature sensor for measuring the temperature of the fixed bearing sidewall and a displacement sensor for measuring thermal deformation of the fixed bearing sidewall;
- and
- a processor in communication with the temperature regulation system and the control system, the processor configured to control the temperature of the fixed bearing sidewall at a desired temperature by activating the temperature regulation system.
Dependencies are inferred from the claim text.