B28D 5/02
Fine working of gems, jewels, crystals: by rotary tools
Official title: by rotary tools, e.g. drills {(B28D5/0005 takes precedence)}
B28D5/02 (Fine working of gems, jewels, crystals: by rotary tools) appears on 412 US grants and 357 published applications in this corpus.
Search patents in B28D- Granted patents
- 412
- Published applications
- 357
- Assignees
- 179
- Inventors
- 771
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 7 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 11 | 0 |
| 1991 | 6 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 10 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 13 | 0 |
| 2001 | 15 | 12 |
| 2002 | 23 | 24 |
| 2003 | 20 | 23 |
| 2004 | 17 | 21 |
| 2005 | 16 | 18 |
| 2006 | 11 | 14 |
| 2007 | 4 | 21 |
| 2008 | 8 | 10 |
| 2009 | 8 | 8 |
| 2010 | 8 | 13 |
| 2011 | 7 | 8 |
| 2012 | 6 | 9 |
| 2013 | 7 | 11 |
| 2014 | 10 | 11 |
| 2015 | 7 | 15 |
| 2016 | 15 | 16 |
| 2017 | 14 | 9 |
| 2018 | 5 | 19 |
| 2019 | 15 | 19 |
| 2020 | 13 | 16 |
| 2021 | 13 | 20 |
| 2022 | 13 | 12 |
| 2023 | 15 | 12 |
| 2024 | 7 | 4 |
| 2025 | 10 | 4 |
| 2026 | 3 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Processing apparatus, and installing method of processing tool of processing apparatus15 Sep 2026US 12,734,631 B2Tokyo Electron Limited
- Method for manufacturing liquid ejection head and liquid ejection head25 Aug 2026US 12,715,216 B2Canon Kabushiki Kaisha
- Cutting apparatus, tray, and transport system30 Jun 2026US 12,672,506 B2Disco Corporation
- Flange21 Oct 2025US 12,447,570 B2Disco Corporation
- Dividing method of workpiece21 Oct 2025US 12,451,388 B2Disco Corporation
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Square silicon substrate and manufacturing method therefor13 Aug 2026US 2026/0239934 A1Mitsubishi Materials Corporation
- Cutting apparatus, cutting method, and method for manufacturing cut product30 Jul 2026US 2026/0216919 A1Towa Corporation
- Sawing Device for Forming Saw-Cuts into a Semiconductor Product and Method Therefor23 Jul 2026US 2026/0208392 A1Besi Netherlands B.V.
- Spindle apparatus and cutting apparatus for semiconductor package14 May 2026US 2026/0131504 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method for sawing wafers employing multiple indexing techniques for multiple die dimensions289US 6,578,458 B1Micron Technology, Inc. · 2003
- Dual laser cutting of wafers137US 6,562,698 B2Kulicke & Soffa Investments, Inc. · 2003
- Method for separating circuit dies from a wafer112US 5,362,681 AAnaglog Devices, Inc. · 1994
- Method for cutting semiconductor wafers106US 6,576,531 B2Micron Technology, Inc. · 2003
- Semiconductor wafer dicing machine82US 4,688,540 ADisco Abrasive Systems, Ltd. · 1987