Method for manufacturing liquid ejection head and liquid ejection head

A method for manufacturing a liquid ejection head including an element substrate having an ejection port forming member including an ejection port for ejecting liquid and an energy generating element for supplying energy for ejecting the liquid to the ejection port, the method comprising:

• preparing a wafer having the energy generating element and the ejection port forming member on a first surface;
• forming a recessed portion in a second surface which is a surface opposite to the first surface of the wafer;
• and
• cutting the wafer along a plurality of cutting lines provided on the first surface to form a plurality of element substrates,
• wherein the plurality of cutting lines includes a first cutting line extending in a first direction and a second cutting line extending in a second direction intersecting the first cutting line,
• wherein, when viewed from a direction perpendicular to the first surface of the wafer, the recessed portion is formed at a position overlapping the plurality of cutting lines except in an intersection portion of the first cutting line and the second cutting line, and
• wherein, in the intersection portion, the recessed portion is formed corresponding to only one of the first cutting line and the second cutting line, and
• wherein the plurality of cutting lines is provided at positions corresponding to an outline of each of the element substrates.

A method for manufacturing a liquid ejection head comprising:

• an element substrate having, on a first surface, an ejection port forming member including an ejection port for ejecting liquid and an energy generating element for supplying energy for ejecting the liquid to the ejection port,
• wherein the element substrate has an inclined surface in an outer peripheral portion on a second surface that is a surface opposite to the first surface,
• wherein the inclined surface is provided on an entire side of the element substrate extending in a first direction, and
• wherein the inclined surface is not provided on a side corresponding to a side extending in a second direction intersecting the side at four corners of the element substrate,
• the method for manufacturing the liquid ejection head comprising:
• preparing a wafer having the energy generating element and the ejection port forming member on a first surface;
• forming a recessed portion in a second surface which is a surface opposite to the first surface of the wafer;
• and
• cutting the wafer along a plurality of cutting lines provided on the first surface to form a plurality of element substrates,
• wherein the plurality of cutting lines includes a first cutting line extending in a first direction and a second cutting line extending in a second direction intersecting the first cutting line,
• wherein, when viewed from a direction perpendicular to the first surface of the wafer, the recessed portion is formed at a position overlapping the plurality of cutting lines except in an intersection portion of the first cutting line and the second cutting line,
• wherein, in the intersection portion, the recessed portion is formed corresponding to only one of the first cutting line and the second cutting line, and
• wherein the plurality of cutting lines is provided at positions corresponding to an outline of each of the element substrates.

A method for manufacturing a liquid ejection head comprising:

• an element substrate having, on a first surface, an ejection port forming member including an ejection port for ejecting liquid and an energy generating element for supplying energy for ejecting the liquid to the ejection port,
• wherein the element substrate has an inclined surface in an outer peripheral portion on a second surface that is a surface opposite to the first surface,
• wherein the inclined surface is provided on an entire side of the element substrate extending in a first direction, and
• wherein the inclined surface is not provided on a side corresponding to a side extending in a second direction intersecting the side at four corners of the element substrate,
• the method for manufacturing the liquid ejection head comprising:
• preparing a wafer having the energy generating element and the ejection port forming member on a first surface;
• forming a recessed portion in a second surface which is a surface opposite to the first surface of the wafer;
• and
• cutting the wafer along a plurality of cutting lines provided on the first surface to form a plurality of element substrates,
• wherein the plurality of cutting lines includes a first cutting line extending in a first direction and a second cutting line extending in a second direction intersecting the first cutting line,
• wherein, when viewed from a direction perpendicular to the first surface of the wafer, the recessed portion is formed at a position overlapping the plurality of cutting lines except in an intersection portion of the first cutting line and the second cutting line,
• wherein, in the intersection portion, the recessed portion is formed corresponding to only one of the first cutting line and the second cutting line, and
• wherein the plurality of cutting lines is provided at positions corresponding to an outline of each of the element substrates, and
• wherein the recessed portion is formed corresponding to only the first cutting line in the intersection portion.