Method for cutting semiconductor wafers

A method of operating a semiconductor substrate saw, comprising:

• rotating a blade of the saw without contacting the blade with a flow of liquid;
• monitoring a distance to a face of the blade as the blade rotates;
• determining a first average baseline distance to the face of the blade and determining a first deviation from the first average baseline distance as the blade rotates;
• indicating an error if the first deviation is greater than a predetermined maximum deviation;
• and, only if the error is not indicated,
• making a first cut at least partially through a semiconductor substrate with the blade while contacting the blade with a flow of liquid.

A method of cutting a semiconductor substrate, comprising:

• positioning the semiconductor substrate with respect to a blade of a saw;
• rotating the blade in a first spaced position wherein a cutting edge of the blade is spaced from the semiconductor substrate;
• measuring a distance to a face of the blade with a sensor as the blade is rotated in the first spaced position and determining a first average distance to the face of the blade and a first deviation from the first average distance as the blade is rotated, the first deviation being indicative of irregularities in the motion of the blade as it rotates;
• and,
• if the first deviation is no greater than a maximum permitted deviation, contacting the semiconductor substrate with the cutting edge of the blade and translating the blade with respect to the semiconductor substrate to cut at least partially through the semiconductor substrate;
• or
• if the first deviation is greater than the maximum permitted deviation, indicating an error.