B28D 5/021
By drilling
Official title: {by drilling}
B28D5/021 (By drilling) appears on 14 US grants and 17 published applications in this corpus.
Search patents in B28D- Granted patents
- 14
- Published applications
- 17
- Assignees
- 13
- Inventors
- 42
- Latest grant
- 15 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 5 |
| 2016 | 4 | 0 |
| 2017 | 1 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 2 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Minimally invasive microsampler for intact removal of surface deposits and substrates15 Jul 2025US 12,360,016 B2Westinghouse Electric Corp.
- Method for machining synthetic quartz glass substrate13 Jun 2023US 11,673,385 B2Shin-Etsu Chemical Co., Ltd.
- Minimally invasive microsampler for intact removal of surface deposits and substrates7 Feb 2023US 11,573,156 B2Westinghouse Electric Corp.
- Mechanical seed coupling6 Apr 2021US 10,968,934 B2Mitsubishi Materials Corporation
- Semiconductor substrate manufacturing method9 Apr 2019US 10,253,432 B2Sumitomo Chemical Company, Limited
- Spindle apparatus and cutting apparatus for semiconductor package14 May 2026US 2026/0131504 A1Samsung Electronics Co., Ltd.
- Minimally invasive microsampler for intact removal of surface deposits and substrates13 Jul 2023US 2023/0221215 A1Westinghouse Electric Corp.
- Method for machining synthetic quartz glass substrate28 Apr 2022US 2022/0126558 A1Shin-Etsu Chemical Co., Ltd.
- Minimally invasive microsampler for intact removal of surface deposits and substrates16 Jul 2020US 2020/0225122 A1Westinghouse Electric Corp.
- Core drill bit and methods of forming the same31 Oct 2019US 2019/0329449 A1Saint-Gobain Abrasifs
Most cited
By later US patents
- Core drill71US 4,047,828 A1977
- Method and apparatus for drilling fine holes in frangible workpieces12US 4,052,132 A1977
- Ductile mode drilling methods for brittle components of plasma processing apparatuses9US 9,314,854 B2Lam Research Corporation · 2016
- Method for producing a quartz-glass hollow cylinder8US 9,481,108 B2Heraeus Quarzglas GmbH & Co.KG · 2016
- Fluted diamond drill6US 4,083,351 A1978