Sawing Device for Forming Saw-Cuts into a Semiconductor Product and Method Therefor
AssigneeBesi Netherlands B.V.
InventorsMark Hermans, Sietse Langius
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AssigneeBesi Netherlands B.V.
InventorsMark Hermans, Sietse Langius
Estimating the term…
The present invention relates to a sawing device for forming saw-cuts into a semiconductor product. The sawing device includes: a carrier including a holding surface for holding the semiconductor product, a saw blade comprising a cutting edge, moveable relative to the carrier, a first position sensor for determining the position of a point on a free surface of the semiconductor product held by the carrier relative to said first position sensor, a second position sensor for determining the position of a point on the cutting edge of the saw blade relative to said second position sensor, and control unit linked to the first position sensor and the second position sensor. The control unit is configured for controlling the relative movement of the saw blade and the carrier.
A sawing device for forming saw-cuts into a semiconductor product, comprising:
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A method for forming saw-cuts into a semiconductor product, comprising the steps of:
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Dependencies are inferred from the claim text.