B28D 5/04
Fine working of gems, jewels, crystals: by tools other than rotary type
Official title: by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)}
B28D5/04 (Fine working of gems, jewels, crystals: by tools other than rotary type) appears on 417 US grants and 441 published applications in this corpus.
Search patents in B28D- Granted patents
- 417
- Published applications
- 441
- Assignees
- 265
- Inventors
- 1,022
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 6 | 0 |
| 1979 | 5 | 0 |
| 1980 | 8 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 11 | 0 |
| 1999 | 17 | 0 |
| 2000 | 14 | 0 |
| 2001 | 7 | 4 |
| 2002 | 11 | 6 |
| 2003 | 9 | 8 |
| 2004 | 5 | 7 |
| 2005 | 5 | 4 |
| 2006 | 5 | 12 |
| 2007 | 4 | 13 |
| 2008 | 8 | 8 |
| 2009 | 4 | 9 |
| 2010 | 7 | 19 |
| 2011 | 8 | 18 |
| 2012 | 14 | 15 |
| 2013 | 5 | 29 |
| 2014 | 12 | 24 |
| 2015 | 17 | 35 |
| 2016 | 21 | 23 |
| 2017 | 21 | 14 |
| 2018 | 16 | 24 |
| 2019 | 17 | 22 |
| 2020 | 11 | 16 |
| 2021 | 12 | 20 |
| 2022 | 12 | 26 |
| 2023 | 15 | 28 |
| 2024 | 21 | 17 |
| 2025 | 25 | 34 |
| 2026 | 11 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for controlling surface profiles of wafers sliced in a wire saw22 Sep 2026US 12,741,397 B2GlobalWafers Co., Ltd.
- Sound-assisted crack propagation for semiconductor wafering4 Aug 2026US 12,697,753 B2Arizona Board of Regents on behalf of Arizona State University
- Lower jacking member, wire withdrawal method, and squaring machine12 May 2026US 12,623,374 B2Fuzhou Skywiretech Co.,Ltd.
- Monocrystalline SiC substrates having an asymmetrical geometry and method of producing same12 May 2026US 12,628,388 B2SiCrystal GmbH
- Systems and methods for controlling wafer breakage during ingot slicing operations5 May 2026US 12,617,032 B2GlobalWafers Co., Ltd.
- Method for simultaneously slicing a multiplicity of slices from a workpiece by means of a wire saw1 Oct 2026US 2026/0295901 A1
- Monocrystalline SiC Substrates Having an Asymmetrical Geometry and Method of Producing Same27 Aug 2026US 2026/0255640 A1SiCrystal GmbH
- Band saw cutting machine20 Aug 2026US 2026/0241610 A1Nachi-Fujikoshi Corp.
- Slicing apparatus and wire-arrangement method thereof28 May 2026US 2026/0145253 A1GlobalWafers Co., Ltd.
- Silicon Rod Cutting System7 May 2026US 2026/0124789 A1Qingdao Gaoce Technology Co., Ltd
Most cited
By later US patents
- Multi-wafer slicing with a fixed abrasive200US 4,646,710 ACrystal Systems, Inc. · 1987
- Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece174US 6,295,977 B1Wacker Chemie AG · 2001
- Dual laser cutting of wafers137US 6,562,698 B2Kulicke & Soffa Investments, Inc. · 2003
- Method for singulating semiconductor wafers66US 6,420,245 B1Kulicke & Soffa Investments, Inc. · 2002
- Method and apparatus for cutting rare earth alloy62US 6,443,143 B1Sumitomo Special Metals Co., Ltd. · 2002