B28D 5/047
By ultrasonic cutting
Official title: {by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04)}
B28D5/047 (By ultrasonic cutting) appears on 43 US grants and 42 published applications in this corpus.
Search patents in B28D- Granted patents
- 43
- Published applications
- 42
- Assignees
- 20
- Inventors
- 75
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 3 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 2 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 6 |
| 2016 | 4 | 2 |
| 2017 | 4 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 9 |
| 2020 | 1 | 2 |
| 2021 | 5 | 2 |
| 2022 | 5 | 4 |
| 2023 | 2 | 5 |
| 2024 | 2 | 0 |
| 2025 | 2 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sound-assisted crack propagation for semiconductor wafering4 Aug 2026US 12,697,753 B2Arizona Board of Regents on behalf of Arizona State University
- Wafer production system and wafer manufacturing method2 Dec 2025US 12,486,187 B2Disco Corporation
- Peeling method and peeling apparatus20 May 2025US 12,304,110 B2Disco Corporation
- Acoustic cleaving apparatus and methods of acoustic cleaving1 Oct 2024US 12,103,200 B1Crystal Sonic, Inc.
- Cutting method24 Sep 2024US 12,097,633 B2Disco Corporation
- Acoustic cleaving apparatus and methods of acoustic cleaving16 Jan 2025US 2025/0018426 A1Crystal Sonic, Inc.
- Method and system for acoustic cleaving16 Jan 2025US 2025/0024754 A1Crystal Sonic, Inc.
- Method of manufacturing wafer and separating apparatus9 Jan 2025US 2025/0010519 A1Disco Corporation
- Peeling apparatus23 Nov 2023US 2023/0373129 A1Disco Corporation
- Wafer production system and wafer manufacturing method19 Oct 2023US 2023/0331614 A1Disco Corporation
Most cited
By later US patents
- Ultrasonic drilling apparatus54US 4,828,052 AThe United States of America as represented by the United States Department of Energy · 1989
- Method of machining a thermosetting laminate39US 6,146,252 APerstorp Flooring AB · 2000
- Method for producing sonotrodes37US 5,709,823 ATHERA Patent GmbH & Co.KG Gesellschaft fur industrielle Schutzrechte · 1998
- Apparatus for marking identification symbols on wafer29US 4,166,574 ATokyo Shibaura Electric Co., Ltd. · 1979
- Ultrasonic cutting apparatus and methods25US 4,567,797 A1986