Method of manufacturing wafer and separating apparatus
AssigneeDisco Corporation
InventorKazuya HIRATA
Life of this patent
Estimating the term…
Abstract
After ultrasonic waves have been applied via a layer of liquid to an ingot for separating the ingot along separation layers formed therein to thereby produce a wafer from the ingot, the wafer and the ingot are moved relatively to each other along a direction in which the separation layers extend, thereby pulling apart the wafer and the ingot from each other.
Claims6
A method of manufacturing a wafer from an ingot, comprising:
- a separation layer forming step of alternately repeating relative movement along a predetermined direction of the ingot and a focused spot of a laser beam having a wavelength transmittable through a material of the ingot while the focused spot is being positioned within the ingot and relative movement of the ingot and a position where the focused spot is formed along a direction perpendicular to the predetermined direction, thereby forming, in the ingot, a plurality of separation layers each including a modified area and cracks developed from the modified area;
- after the separation layer forming step, an ultrasonic wave applying step of applying ultrasonic waves via a layer of liquid to the ingot to separate the ingot along the separation layers, thereby producing the wafer from the ingot;
- and
- after the ultrasonic wave applying step, a pulling-apart step of pulling apart the wafer and the ingot from each other by moving the wafer and the ingot relatively to each other along the predetermined direction.
A method of manufacturing a wafer from an ingot having formed therein a plurality of separation layers each extending in a predetermined direction and including a modified area and cracks developed from the modified area, comprising:
- an ultrasonic wave applying step of applying ultrasonic waves via a layer of liquid to the ingot to separate the ingot along the separation layers, thereby producing the wafer from the ingot;
- and
- after the ultrasonic wave applying step, a pulling-apart step of pulling apart the wafer and the ingot from each other by moving the wafer and the ingot relatively to each other along the predetermined direction.
A separating apparatus for manufacturing a wafer from an ingot having formed therein a plurality of separation layers each extending in a predetermined direction and including a modified area and cracks developed from the modified area, comprising:
- a first holding unit for holding the ingot thereon;
- a second holding unit for holding the wafer thereon;
- an ultrasonic wave applying unit for applying ultrasonic waves via a layer of liquid to the ingot held on the first holding unit;
- a moving mechanism for moving the first holding unit and the second holding unit relatively to each other along the predetermined direction;
- and
- a controller for controlling the first holding unit, the second holding unit, the ultrasonic wave applying unit, and the moving mechanism, wherein
- the controller, while controlling the first holding unit to hold the ingot thereon, controls the ultrasonic wave applying unit to apply ultrasonic waves via the layer of liquid to the ingot for separating the ingot along the separation layers to thereby produce the wafer, and thereafter, while controlling the first holding unit to hold the ingot thereon and controlling the second holding unit to hold the wafer thereon, controls the moving mechanism to move the first holding unit and the second holding unit relatively to each other along the predetermined direction for pulling apart the wafer and the ingot from each other.
Dependencies are inferred from the claim text.