Peeling apparatus

A peeling apparatus for peeling off a wafer from an ingot having a peeling layer formed therein at a depth corresponding to the wafer to be manufactured, the peeling apparatus comprising:

• a holding table that holds the ingot;
• a water supply unit that forms a layer of water on an upper surface of the ingot;
• an ultrasonic unit that applies an ultrasonic wave to the upper surface of the ingot through the layer of water;
• a peeling confirmation unit that confirms peeling-off of the wafer to be manufactured;
• a wafer delivery unit that lowers a suction pad having a suction surface facing the upper surface of the ingot, to hold the wafer to be manufactured on the suction surface under suction, and delivers the wafer from the ingot;
• and
• a controller,
• wherein after the peeling-off of the wafer is confirmed by the peeling confirmation unit, the controller positions the water supply unit, the ultrasonic unit, and the peeling confirmation unit at retracted positions and operates the wafer delivery unit to deliver the wafer from the ingot.