Cutting method

A cutting method of cutting a semiconductor wafer workpiece, the cutting method comprising:

• a providing step of providing a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade;
• a holding step of holding the workpiece by the chuck table;
• a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and a rotational cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on a plurality of cutting lines set on the workpiece, each cutting line of the plurality of cutting lines extending in one of an X-axis direction and a Y-axis direction, each cutting line of the plurality of cutting lines having a first portion extending from a first position to a predetermined position and a second portion extending from the predetermined position to a second position;
• and
• wherein, in the cutting step, the ultrasonic cutting is performed in each of the first portions, and the rotational cutting is performed in each of the second portions;
• and
• wherein the first portion and the second portion extend along the same axis extending in one of the X-axis direction or Y-axis direction.