B28D 5/042
By cutting with blades or wires mounted in a reciprocating frame
Official title: {by cutting with blades or wires mounted in a reciprocating frame}
B28D5/042 (By cutting with blades or wires mounted in a reciprocating frame) appears on 49 US grants and 31 published applications in this corpus.
Search patents in B28D- Granted patents
- 49
- Published applications
- 31
- Assignees
- 43
- Inventors
- 99
- Latest grant
- 12 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 2 |
| 2002 | 1 | 2 |
| 2003 | 2 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 2 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 1 | 2 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 3 |
| 2022 | 1 | 5 |
| 2023 | 2 | 1 |
| 2024 | 5 | 0 |
| 2025 | 0 | 4 |
By publication year. Applications have been published since 2001.
Recent patents
- SiC wafer and manufacturing method for SiC wafer12 Nov 2024US 12,139,813 B2Toyota Tsusho Corporation
- Wire saw having dust collecting apparatus8 Oct 2024US 12,109,729 B2Egun Co., Ltd.
- Method for slicing workpiece and wire saw16 Apr 2024US 11,958,160 B2Shin-Etsu Handotai Co., Ltd.
- Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate13 Feb 2024US 11,901,170 B2JX Metals Corporation
- Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate6 Feb 2024US 11,894,225 B2JX Metals Corporation
- Cutting method and manufacturing method for chip9 Oct 2025US 2025/0312944 A1Disco Corporation
- Automatic stroke setting apparatus of cutting device using multi-wire10 Jul 2025US 2025/0222627 A1Hanwha Precision Machinery Co., Ltd.
- Crystal wafering system and method22 May 2025US 2025/0162198 A1Scientific Visual SA
- Cutting monocrystalline silicon square rod30 Jan 2025US 2025/0033247 A1Tcl Zhonghuan Renewable Energy Technology Co., Ltd.
- Methods of recycling silicon swarf into electronic grade polysilicon or metallurgical-grade silicon4 May 2023US 2023/0136895 A1SunPower Corporation
Most cited
By later US patents
- Multi-wafer slicing with a fixed abrasive200US 4,646,710 ACrystal Systems, Inc. · 1987
- Cutting32US 4,187,828 ACrystal Systems, Inc. · 1980
- Manufacturing semiconductor wafer devices by simultaneous slicing and etching32US 4,343,662 AAtlantic Richfield Company · 1982
- Multi-wafer slicing with a fixed abrasive28US 4,727,852 ACrystal Systems, Inc. · 1988
- Method of slicing a wafer23US 4,227,348 ARCA Corporation · 1980