Manufacturing semiconductor wafer devices by simultaneous slicing and etching

Abstract

A method of forming semiconductor devices incorporates etching during the slicing of a semiconductor ingot from which semiconductor wafers are formed. In addition, a partial slicing through the ingot yields partially cut wafers which are maintained integral beyond a diffusion step. Grinding is then employed to remove unwanted material, to shape, and to accomplish the separation of the wafers. A doped, silicon ingot is used with a solution of sodium hydroxide or potassium hydroxide as the etchant. With the ingot in the [111] type of crystal orientation, the etching proceeds readily adjacent to the slicing cuts to facilitate the slicing, and proceeds slowly elsewhere to minimize material wastage. As a result, the formation of extremely thin wafers with minimal cutting loss is possible.

Dependencies are inferred from the claim text.