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US 4,646,710 AGranted
Multi-wafer slicing with a fixed abrasive
AssigneeCrystal Systems, Inc.
InventorsFrederick Schmid, Chandra P. Khattak, Maynard B. Smith
Life of this patent
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Abstract
A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.
Claims10
A wafering machine comprising
- a bladehead supporting a multiplicity of taut parallel wire cutting blades,
- a support on which said bladehead is mounted for sliding reciprocation along an axis parallel to said wire blades,
- means for reciprocally moving the bladehead along said axis through a stroke,
- a workpiece holder mounted to move perpendicular to said bladehead,
- means for biasing said workpiece holder toward said bladehead, and
- means for rocking the workpiece holder about a rocking axis perpendicular to said blades at a frequency less than that for the reciprocation of said bladehead, to decrease the contact lengths of said blades on said workpiece and thus increase the pressure between said wire blades and workpiece without increasing the force applied to said wire blades by said means for biasing.
3 more elements
A method of cutting wafers from a hard material comprising
- providing a bladehead including a multiplicity of taut parallel wire cutting blades,
- biasing said material against said bladehead with a workpiece holder, and
- reciprocally moving said bladehead relative to said material along an axis parallel to said wire blades, and
- rocking said workpiece holder about a rocking axis perpendicular to said blades at a frequency less than that for the reciprocation of said bladehead, to decrease the contact lengths of said blades on said workpiece and thus increase the pressure of said blades without increasing the force applied to said blades by said means for biasing.
1 more element
Dependencies are inferred from the claim text.