Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece

A wire saw comprising

• a wire web made from a sawing wire for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece;
• a feed device, which effects a relative translational movement, directed perpendicular to a longitudinal axis of the workpiece, between the workpiece and the wire web of the wire saw, in the course of which movement the workpiece is guided through the wire web;
• a device for holding the workpiece and for rotating the workpiece about the longitudinal axis, comprising spindle sleeves and rollers which are arranged in such a manner that they can be moved toward the workpiece and away from the workpiece;
• and
• said spindle sleeves clamping the workpiece axially and said rollers supporting the workpiece on a peripheral surface.

A method for simultaneously cutting off a multiplicity of wafers from hard, brittle workpieces which are hollow bodies and have longitudinal axes and inner peripheral surfaces comprising;

• joining the workpieces to support bodies along the inner peripheral surfaces;
• placing the workpieces next to one another;
• rotating the workpieces by rotating the support bodies;
• guiding the workpieces by a relative translational movement, directed perpendicular to the longitudinal axes, between the workpieces and a wire web of a wire saw with a feed device, through the wire web which is formed by a sawing wire, thereby cutting off the wafers form the workpieces simultaneously;
• penetrating the sawing wire into the support bodies after the wafers have been cut off, without cutting all the way through the support bodies.