Systems and methods for controlling wafer breakage during ingot slicing operations

A system for slicing wafers from a monocrystalline semiconductor ingot, the system comprising:

• the monocrystalline semiconductor ingot;
• a wire saw including a wire web and wire guides operable to drive the wire web during a slicing operation;
• a bond beam connected to the wire saw, the wire saw operable to move the bond beam towards the wire web during the slicing operation to slice the wafers from the ingot;
• the monocrystalline semiconductor ingot comprising longitudinal end faces and a circumferential edge extending between the longitudinal end faces, the ingot attached to the bond beam along the circumferential edge;
• and
• two sacrificial disks, wherein one sacrificial disk is positioned adjacent each of the longitudinal end faces of the ingot to inhibit uncontrolled breakage of the wafers during the slicing operation, wherein the ingot has an outer ingot diameter and the sacrificial disks each have an outer disk diameter that is smaller than the outer ingot diameter, wherein an outer circumferential edge of each sacrificial disk is attached to the bond beam such that each sacrificial disk is axially offset from a longitudinal axis of the adjacent longitudinal end face.