B28D 5/045
By cutting with wires or closed-loop blades
Official title: {by cutting with wires or closed-loop blades (B28D5/042 takes precedence)}
B28D5/045 (By cutting with wires or closed-loop blades) appears on 292 US grants and 324 published applications in this corpus.
Search patents in B28D- Granted patents
- 292
- Published applications
- 324
- Assignees
- 186
- Inventors
- 748
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 17 | 0 |
| 2000 | 13 | 0 |
| 2001 | 6 | 1 |
| 2002 | 8 | 3 |
| 2003 | 4 | 5 |
| 2004 | 4 | 7 |
| 2005 | 5 | 3 |
| 2006 | 4 | 7 |
| 2007 | 4 | 9 |
| 2008 | 6 | 5 |
| 2009 | 3 | 7 |
| 2010 | 3 | 17 |
| 2011 | 7 | 17 |
| 2012 | 13 | 14 |
| 2013 | 5 | 28 |
| 2014 | 9 | 22 |
| 2015 | 17 | 27 |
| 2016 | 17 | 17 |
| 2017 | 14 | 8 |
| 2018 | 14 | 19 |
| 2019 | 14 | 12 |
| 2020 | 6 | 7 |
| 2021 | 5 | 10 |
| 2022 | 3 | 17 |
| 2023 | 9 | 16 |
| 2024 | 14 | 15 |
| 2025 | 18 | 25 |
| 2026 | 10 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for controlling surface profiles of wafers sliced in a wire saw22 Sep 2026US 12,741,397 B2GlobalWafers Co., Ltd.
- Lower jacking member, wire withdrawal method, and squaring machine12 May 2026US 12,623,374 B2Fuzhou Skywiretech Co.,Ltd.
- Monocrystalline SiC substrates having an asymmetrical geometry and method of producing same12 May 2026US 12,628,388 B2SiCrystal GmbH
- Systems and methods for controlling wafer breakage during ingot slicing operations5 May 2026US 12,617,032 B2GlobalWafers Co., Ltd.
- Methods for controlling wafer breakage during ingot slicing operations21 Apr 2026US 12,605,863 B2GlobalWafers Co., Ltd.
- Method for simultaneously slicing a multiplicity of slices from a workpiece by means of a wire saw1 Oct 2026US 2026/0295901 A1
- Monocrystalline SiC Substrates Having an Asymmetrical Geometry and Method of Producing Same27 Aug 2026US 2026/0255640 A1SiCrystal GmbH
- Band saw cutting machine20 Aug 2026US 2026/0241610 A1Nachi-Fujikoshi Corp.
- Slicing apparatus and wire-arrangement method thereof28 May 2026US 2026/0145253 A1GlobalWafers Co., Ltd.
- Silicon Rod Cutting System7 May 2026US 2026/0124789 A1Qingdao Gaoce Technology Co., Ltd
Most cited
By later US patents
- Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece174US 6,295,977 B1Wacker Chemie AG · 2001
- Method and apparatus for cutting rare earth alloy62US 6,443,143 B1Sumitomo Special Metals Co., Ltd. · 2002
- Brittle material cutting method46US 5,201,305 ANippei Toyama Corporation · 1993
- Wire saw and method for cutting wafers from a workpiece42US 5,616,065 AWacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft · 1997
- Wire saw and slicing method using the same39US 5,269,285 AShin-Etsu Handotai Co., Ltd. · 1993