Wire saw and method for cutting wafers from a workpiece
AssigneeWacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft
InventorKarl Egglhuber
Life of this patent
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Abstract
A sawing method and a wire saw for cutting wafers from a workpiece comprises a guidance system for the guidance of wire segments into the intended cutting planes, having at least one measuring device and at least one controlling device, the measuring device detecting an incorrect position of the wire segments in relation to the intended cutting planes by measuring the distance to a measurement point whose spatial position is dependent on the incorrect position of the wire segments, and the controlling device effecting, if necessary, a compensating movement by means of force transmission, which compensating movement brings the wire segments into the intended cutting planes.
Claims24
A wire saw for cutting wafers from a workpiece comprising
- a machine frame;
- a feed device, having a roller system combined to form a cutting head and comprising a plurality of wire guide rollers which are linked to bearing spindles and are rotatably mounted and of which at least one is driven, and having at least one wire web used as sawing tool and comprising wire segments which are disposed in parallel between two wire guide rollers and which are moved perpendicularly to the axes of the wire guide rollers around the roller system and which work through the workpiece along intended cutting planes with the aid of the feed device, with eroding means being supplied and with the formation of a multiplicity of parallel sawing gaps;
- a guidance system for the guidance of the wire segments into the intended cutting planes having at least one measuring device and at least one controlling device;
- the measuring device detecting an incorrect position of the wire segments in relation to the intended cutting planes by measuring the distance from a measurement point whose spatial position is dependent on the incorrect position of the wire segments;
- and
- the controlling device effecting, if necessary, a compensating movement of the wire segments or of the workpiece by means of force transmission, which compensating movement brings the wire segments into the intended cutting planes.
A method for cutting wafers from a workpiece with the aid of a wire saw comprising
- detecting an incorrect position of wire segments in relation to intended cutting planes with the aid of a measuring device by measuring a distance to a measurement point whose spatial position is dependent on an incorrect position of the wire segments;
- and
- in the event of a deviation of the measured distance from a set distance, effecting a compensating movement of the wire segments or of the workpiece with the aid of a controlling device, which compensating movement brings the wire segments into the intended cutting planes.
Dependencies are inferred from the claim text.