B28D 5/0005
Fine working of gems, jewels, crystals: by breaking
Official title: {by breaking, e.g. dicing}
B28D5/0005 (Fine working of gems, jewels, crystals: by breaking) appears on 533 US grants and 607 published applications in this corpus.
Search patents in B28D- Granted patents
- 533
- Published applications
- 607
- Assignees
- 205
- Inventors
- 991
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 9 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 9 | 4 |
| 2002 | 9 | 6 |
| 2003 | 6 | 9 |
| 2004 | 6 | 13 |
| 2005 | 4 | 28 |
| 2006 | 8 | 31 |
| 2007 | 11 | 42 |
| 2008 | 12 | 22 |
| 2009 | 22 | 39 |
| 2010 | 32 | 36 |
| 2011 | 22 | 30 |
| 2012 | 24 | 26 |
| 2013 | 29 | 27 |
| 2014 | 27 | 13 |
| 2015 | 19 | 20 |
| 2016 | 14 | 41 |
| 2017 | 23 | 24 |
| 2018 | 22 | 28 |
| 2019 | 22 | 29 |
| 2020 | 28 | 27 |
| 2021 | 24 | 31 |
| 2022 | 18 | 15 |
| 2023 | 14 | 25 |
| 2024 | 17 | 15 |
| 2025 | 19 | 13 |
| 2026 | 12 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Manufacturing method of gallium nitride substrate22 Sep 2026US 12,741,340 B2Disco Corporation
- Method for producing a detachment region in a solid-state body22 Sep 2026US 12,741,341 B2Siltectra GmbH
- Method for manufacturing liquid ejection head and liquid ejection head25 Aug 2026US 12,715,216 B2Canon Kabushiki Kaisha
- Method for producing a layer of solid material21 Jul 2026US 12,690,429 B2Siltectra GmbH
- Diamond substrate manufacturing method16 Jun 2026US 12,654,259 B2Disco Corporation
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Laser-assisted method for parting crystalline material6 Aug 2026US 2026/0225180 A1Wolfspeed, Inc.
- Method of Wafer Separation18 Jun 2026US 2026/0166778 A1Wolfspeed, Inc.
- Method and system for detecting completion of ingot slicing process7 May 2026US 2026/0124788 A1Industrial Technology Research Institute
Most cited
By later US patents
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- Growth structures and method for forming laser diodes on {30-31} or off cut gallium and nitrogen containing substrates237US 8,351,478 B2Soraa, Inc. · 2013
- Growth structures and method for forming laser diodes on {20-21} or off cut gallium and nitrogen containing substrates234US 8,355,418 B2Soraa, Inc. · 2013
- Substrate dividing method138US 7,566,635 B2Hamamatsu Photonics K.K. · 2009
- Dual laser cutting of wafers137US 6,562,698 B2Kulicke & Soffa Investments, Inc. · 2003