B28D 5/0052
Means for supporting or holding work during breaking
Official title: {Means for supporting or holding work during breaking (means for conveying work to or discharging work from the breaking machine B28D5/0058)}
B28D5/0052 (Means for supporting or holding work during breaking) appears on 87 US grants and 81 published applications in this corpus.
Search patents in B28D- Granted patents
- 87
- Published applications
- 81
- Assignees
- 56
- Inventors
- 209
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 2 | 1 |
| 2003 | 1 | 0 |
| 2004 | 1 | 2 |
| 2005 | 0 | 3 |
| 2006 | 2 | 6 |
| 2007 | 2 | 7 |
| 2008 | 5 | 3 |
| 2009 | 1 | 3 |
| 2010 | 5 | 5 |
| 2011 | 4 | 1 |
| 2012 | 1 | 2 |
| 2013 | 3 | 2 |
| 2014 | 1 | 0 |
| 2015 | 3 | 3 |
| 2016 | 1 | 4 |
| 2017 | 1 | 1 |
| 2018 | 1 | 4 |
| 2019 | 2 | 5 |
| 2020 | 5 | 1 |
| 2021 | 4 | 7 |
| 2022 | 1 | 3 |
| 2023 | 1 | 7 |
| 2024 | 5 | 2 |
| 2025 | 7 | 6 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- β Gallium oxide substrate manufacturing method2 Jun 2026US 12,643,263 B2Disco Corporation
- Upper jacking structure, half-slitting machine and half-slitting method10 Feb 2026US 12,544,953 B2Fuzhou Skywiretech Co.,Ltd.
- Dividing apparatus28 Oct 2025US 12,454,077 B2Disco Corporation
- Dividing method of workpiece21 Oct 2025US 12,451,388 B2Disco Corporation
- Method for cutting substrate elements2 Sep 2025US 12,403,627 B2STMicroelectronics (Grenoble 2) SAS
- Method and system for detecting completion of ingot slicing process7 May 2026US 2026/0124788 A1Industrial Technology Research Institute
- Cooling slicing method for generating wafer22 Jan 2026US 2026/0021608 A1Westlake Instruments (Hangzhou) Technology Co., Ltd.
- Method for manufacturing semiconductor wafers18 Dec 2025US 2025/0381707 A1Denso Corporation
- Generation method of semiconductor wafers20 Nov 2025US 2025/0353215 A1Westlake Instruments (Hangzhou) Technology Co., Ltd.
- Rapid wafering of wide bandgap substrates17 Jul 2025US 2025/0229457 A1
Most cited
By later US patents
- Method of dividing a semiconductor wafer123US 7,129,150 B2Disco Corporation · 2006
- Laser processing method98US 7,939,430 B2Hamamatsu Photonics K.K. · 2011
- Wafer-like processing after sawing DMDs67US 5,445,559 ATexas Instruments Incorporated · 1995
- Method of protecting micromechanical devices during wafer separation65US 5,605,489 ATexas Instruments Incorporated · 1997
- Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same55US 4,961,804 AInvestment Holding Corporation · 1990