Method for cutting substrate elements
AssigneesSTMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) Limited
InventorsMelodie Chaperon, William Halliday, Jean Gagnieux
Life of this patent
Estimating the term…
Abstract
In a method, substrate elements are provided wherein each substrate element has a first side and a second side meeting at a corner point. The substrate elements are picked and then placed on a support device in alignment. A cutting operation is then performed where each of the substrates elements are cut along a cut line having a common first direction which intersects the first and second sides of each of the substrate elements in order to create a third side on each substrate element. The third side of each of the substrate elements meets the first and the second sides at corresponding corner points.
Claims22
A method, comprising:
- providing a plurality of substrate elements, wherein each substrate element has a first side and a second side meeting at a corner point;
- picking and placing the plurality of substrate elements on a support device to be aligned with each other;
- and
- cutting each of the plurality of substrate elements along a first cut line having a first direction common to the plurality of substrate elements and intersecting the first and second sides of each substrate element in order to create a third side on each substrate element, wherein the third side of each substrate element meets the first and the second sides at corresponding corner points.
A method, comprising:
- cutting a substrate, arranged on a holding device, with a cutting tool into a plurality of substrate elements, wherein each substrate element has a first side and a second side meeting at a corner point;
- rotating the cutting tool;
- and
- then cutting the plurality of substrate elements to create at least a third side for each substrate element, the third side meeting the first and the second sides at corresponding corner points.
Dependencies are inferred from the claim text.