Cooling slicing method for generating wafer

Abstract

A cooling slicing method for generating wafer includes the following steps: coating a liquid water-soluble medium on an end surface of an ingot and/or a clamping surface of a temperature-controlled clamp, and cooling and solidifying the water-soluble medium under the action of the temperature-controlled clamp to complete fixing of the ingot between a pair of temperature-controlled clamps; and moving at least one temperature-controlled clamp until a modified layer of the ingot is separated, and after peeling is completed, heating and liquefying the solid water-soluble medium under the action of the temperature-controlled clamp to obtain a wafer and remaining ingot. The method has the advantages of high peeling efficiency, saved cleaning process, easy control of peeling conditions, low risk of cracking, simple operation, and suitability for large-scale industrial applications.

Dependencies are inferred from the claim text.