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US 4,961,804 AGranted
Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same
AssigneeInvestment Holding Corporation
InventorJoseph A. Aurichio
Life of this patent
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Abstract
A dicing film to support semiconductor wafers as they are diced into individual chips comprises a support film (e.g., of thermoplastic polymer), a release layer on one side of the film, and a pattern of conductive adhesive attached to the release layer for bonding to the wafer or wafers. The release layer allows for separation of the chip/conductive adhesive combination from the support film. Preferably, the adhesive is covered by a removable release liner prior to mating of the wafer and adhesive.
Claims17
A dicing film to support semiconductor wafers when they are diced into individual chips which comprises:
- (a) a support film;
- (b) a release layer on one side of the support film;
- and
- (c) a pattern of curable, semiconductor chip bonding, conductive adhesive releasably affixed to the release layer on said support film, the adhesive pattern being of a size and shape to support at least one semiconductor wafer therein, the release layer allowing for pick-up of a semiconductor chip from the support film with adherent conductive adhesive without any substantial destruction of the physical integrity of the adherent adhesive.
1 more element
Dependencies are inferred from the claim text.