Method and system for detecting completion of ingot slicing process

A method for detecting completion of ingot slicing process, performed by a controller for detecting an ingot when the ingot undergoes an ultrasonic slicing process after the ingot is laser-modified, wherein the method comprises:

• controlling an upper suction cup and a lower suction cup to respectively hold a top surface and a bottom surface of the ingot, wherein the upper suction cup is connected to an ultrasonic source and is provided with a load cell, the upper suction cup applies a pulling force in a direction away from the ingot to the top surface while the ultrasonic source generate ultrasonic waves to vibrate the ingot, and the pulling force applied by the upper suction cup to the top surface is detected by the load cell;
• controlling the load cell to detect whether the pulling force applied by the upper suction cup to the top surface is less than a set value;
• if yes, the ultrasonic source is turned off, and the upper suction cup holds a wafer separated from the ingot;
• if no, returning to the previous step;
• controlling an upper vacuum pressure gauge and a lower vacuum pressure gauge to respectively detect whether a space between the upper suction cup and the wafer, and a space between the lower suction cup and the bottom surface of the ingot are kept under vacuum;
• if yes, proceeding to the next step;
• if no, an abnormality handling process is performed;
• controlling a negative pressure proportional regulator valve to detect whether a vacuum pressure between the upper suction cup and the wafer is less than a threshold value, wherein if yes, the abnormality handling process is performed;
• if no, proceeding to the next step;
• turning off the upper suction cup to release the wafer onto a receiving tray, and detecting, by a photoelectric proximity sensor, whether a surface of the wafer is cracked, wherein if yes, the abnormality handling process is performed;
• if no, proceeding to the next step;
• and
• controlling a fork suction cup to hold the wafer from the receiving tray, and detecting, by a fork vacuum pressure gauge, whether a space between the fork suction cup and the wafer is kept under vacuum;
• if no, the abnormality handling process is performed;
• if yes, the wafer is moved out of the receiving tray by the fork suction cup.