B28D 5/0017
Using moving tools
Official title: {using moving tools}
B28D5/0017 (Using moving tools) appears on 108 US grants and 76 published applications in this corpus.
Search patents in B28D- Granted patents
- 108
- Published applications
- 76
- Assignees
- 64
- Inventors
- 236
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 5 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 0 |
| 2002 | 3 | 2 |
| 2003 | 3 | 1 |
| 2004 | 0 | 2 |
| 2005 | 0 | 2 |
| 2006 | 1 | 4 |
| 2007 | 3 | 4 |
| 2008 | 3 | 1 |
| 2009 | 3 | 2 |
| 2010 | 0 | 1 |
| 2011 | 2 | 2 |
| 2012 | 3 | 3 |
| 2013 | 0 | 3 |
| 2014 | 2 | 3 |
| 2015 | 3 | 5 |
| 2016 | 1 | 4 |
| 2017 | 3 | 3 |
| 2018 | 4 | 4 |
| 2019 | 5 | 9 |
| 2020 | 5 | 5 |
| 2021 | 5 | 7 |
| 2022 | 4 | 1 |
| 2023 | 2 | 3 |
| 2024 | 3 | 1 |
| 2025 | 3 | 1 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing liquid ejection head and liquid ejection head25 Aug 2026US 12,715,216 B2Canon Kabushiki Kaisha
- Dividing apparatus28 Oct 2025US 12,454,077 B2Disco Corporation
- Dividing method of workpiece21 Oct 2025US 12,451,388 B2Disco Corporation
- Method of manufacturing chips24 Jun 2025US 12,341,068 B2Disco Corporation
- Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack26 Nov 2024US 12,151,314 B2Siltectra GmbH
- Boules with boule-handling carrier processing methods22 Jan 2026US 2026/0021609 A1Wolfspeed, Inc.
- Sic semiconductor device and method of manufacturing the sic semiconductor device8 Jan 2026US 2026/0011655 A1Mitsuboshi Diamond Industrial Co., Ltd.
- Process for dividing single-crystal substrates1 Jan 2026US 2026/0002287 A1Mitsuboshi Diamond Industrial Co., Ltd.
- Rapid wafering of wide bandgap substrates17 Jul 2025US 2025/0229457 A1
- Method for manufacturing liquid ejection head and liquid ejection head18 Jul 2024US 2024/0239104 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Backside laser dicing system86US 3,970,819 AInternational Business Machines Corporation · 1976
- Nozzle for cleaving substrates71US 6,263,941 B1Silicon Genesis Corporation · 2001
- Substrate cleaving tool and method70US 6,221,740 B1Silicon Genesis Corporation · 2001
- Nozzle for cleaving substrates68US 6,513,564 B2Silicon Genesis Corporation · 2003
- Method for batch cleaving semiconductor wafers and coating cleaved facets58US 5,171,717 AInternational Business Machines Corporation · 1992