B28D 5/0023
Rectilinearly
Official title: {rectilinearly}
B28D5/0023 (Rectilinearly) appears on 59 US grants and 37 published applications in this corpus.
Search patents in B28D- Granted patents
- 59
- Published applications
- 37
- Assignees
- 42
- Inventors
- 141
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 0 |
| 2002 | 3 | 2 |
| 2003 | 3 | 0 |
| 2004 | 0 | 2 |
| 2005 | 0 | 2 |
| 2006 | 1 | 2 |
| 2007 | 3 | 3 |
| 2008 | 2 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 2 | 1 |
| 2012 | 1 | 2 |
| 2013 | 0 | 3 |
| 2014 | 2 | 1 |
| 2015 | 1 | 2 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 2 |
| 2019 | 1 | 4 |
| 2020 | 2 | 3 |
| 2021 | 3 | 2 |
| 2022 | 3 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dividing apparatus28 Oct 2025US 12,454,077 B2Disco Corporation
- Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack26 Nov 2024US 12,151,314 B2Siltectra GmbH
- Wafer processing method23 Aug 2022US 11,420,294 B2Disco Corporation
- Nitride semiconductor light-emitting element, method for manufacturing nitride semiconductor light-emitting element, and nitride semiconductor light-emitting device19 Apr 2022US 11,309,688 B2Nuvoton Technology Corporation Japan
- Method of fabricating semiconductor light-emitting device and semiconductor light-emitting device22 Mar 2022US 11,283,233 B2Nuvoton Technology Corporation Japan
- Process for dividing single-crystal substrates1 Jan 2026US 2026/0002287 A1Mitsuboshi Diamond Industrial Co., Ltd.
- Rapid wafering of wide bandgap substrates17 Jul 2025US 2025/0229457 A1
- Dividing apparatus7 Sep 2023US 2023/0278260 A1Disco Corporation
- Apparatus for separating a solar cell into two or more solar cell pieces, system for the manufacture of at least one shingled solar cell arrangement, and method for separating a solar cell into two or more solar cell pieces21 Oct 2021US 2021/0328091 A1Applied Materials Italia S.R.L.
- Planarization process, apparatus and method of manufacturing an article18 Feb 2021US 2021/0050218 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Nozzle for cleaving substrates71US 6,263,941 B1Silicon Genesis Corporation · 2001
- Substrate cleaving tool and method70US 6,221,740 B1Silicon Genesis Corporation · 2001
- Nozzle for cleaving substrates68US 6,513,564 B2Silicon Genesis Corporation · 2003
- Wafer method for breaking a semiconductor54US 5,527,744 ATexas Instruments Incorporated · 1996
- Method for cleaving a semiconductor crystal body41US 5,272,114 AAmoco Corporation · 1993