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US 6,263,941 B1Granted
Nozzle for cleaving substrates
AssigneeSilicon Genesis Corporation
InventorsMichael A. Bryan, James K. Kai
Life of this patent
Estimating the term…
Abstract
A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.
Claims6
A tool for cleaving a substrate, the tool comprising:
- a body portion having an end and a face opposite the end;
- a force sensor disposed on the face, the force sensor providing an output when struck;
- a chisel edge portion formed on the end of the body portion;
- and
- a gas chamber wall defining a gas via through the tool, the via terminating in a gas port disposed along the chisel edge portion of the tool.
2 more elements
Dependencies are inferred from the claim text.