Method for cleaving a semiconductor crystal body
AssigneeAmoco Corporation
InventorsPetrus A. van Berkum, Ronald P. Mathius
Life of this patent
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Abstract
A method for cleaving a semiconductor crystal body having a first surface and an opposite second surface, comprising the steps of forming a channel on the first surface of the semiconductor, scribing a portion of the second surface opposite the channel on the first surface, and mechanically cleaving the semiconductor along a plane defined by said channel on the first surface and said scribe on the second surface.
Claims20
A method for cleaving a semiconductor crystal body having a first surface and an opposite second surface, comprising the steps of:
- a) forming a channel on the first surface of the semiconductor, said channel including sidewalls and a bottom therebetween;
- b) scribing a portion of a total length of the second surface opposite said channel and between the planes of said sidewalls thereof on the first surface;
- and
- c) mechanically cleaving the semiconductor along a plane defined by said channel on the first surface and said scribe on the second surface.
A method for cleaving a semiconductor crystal body, said semiconductor crystal body comprising a substrate having a plurality of semiconductor layers deposited epitaxially thereon, wherein at least one of said layers when appropriately biased generates electromagnetic radiation, and wherein said semiconductor crystal body has a first surface and an opposite second surface, comprising the steps of:
- a) forming a plurality of parallel channels having sidewalls and a bottom therebetween across the first surface of the semiconductor crystal body;
- b) making a plurality of scribes along a portion of a total length of the second surface opposite said channels and between the planes of said sidewalls thereof on the first surface;
- and
- c) mechanically cleaving the semiconductor body along each plane defined by one of said channels of the first surface and said opposing scribe on the second surface.
Dependencies are inferred from the claim text.