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US 6,513,564 B2Granted
Nozzle for cleaving substrates
AssigneeSilicon Genesis Corporation
InventorsMichael A. Bryan, James K. Kai
Life of this patent
Estimating the term…
Abstract
A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.
Claims5
A tool for cleaving a substrate, comprising:
- a chamber for housing said substrate;
- a body portion coupled to said chamber, said body portion being configured to align with an edge portion of the substrate;
- a contacting edge disposed at a first end of said body portion, said contacting edge having a perimeter adapted for contacting said edge of said substrate to cause an initiation of a separation of a portion of the edge of the substrate;
- and
- a channel disposed in said body portion, having a first terminus coincident along said perimeter of said contacting edge and having a second terminus adapted for infusion of a fluid into said channel,
- wherein said fluid flows through said channel and effuses through said first terminus to contact said edge of said substrate to cause at least a propagation of said separation of said portion of the edge of the substrate.
3 more elements
Dependencies are inferred from the claim text.