B28D 5/0041
The workpiece being brought into contact with a suitably shaped rigid body
Official title: {the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking}
B28D5/0041 (The workpiece being brought into contact with a suitably shaped rigid body) appears on 24 US grants and 20 published applications in this corpus.
Search patents in B28D- Granted patents
- 24
- Published applications
- 20
- Assignees
- 22
- Inventors
- 71
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 2 | 1 |
| 2019 | 1 | 3 |
| 2020 | 0 | 1 |
| 2021 | 3 | 3 |
| 2022 | 0 | 0 |
| 2023 | 2 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Upper jacking structure, half-slitting machine and half-slitting method10 Feb 2026US 12,544,953 B2Fuzhou Skywiretech Co.,Ltd.
- Semiconductor chip manufacturing device and method of manufacturing semiconductor chips30 Apr 2024US 11,973,309 B2Mitsubishi Electric Corporation
- Processing apparatus including a water collection pan4 Jul 2023US 11,691,313 B2Disco Corporation
- Cold fluid semiconductor device release during pick and place operations, and associated systems and methods28 Feb 2023US 11,594,432 B2Micron Technology, Inc.
- Planarization process, apparatus and method of manufacturing an article15 Jun 2021US 11,034,057 B2Canon Kabushiki Kaisha
- Upper jacking structure, half-slitting machine and half-slitting method27 Feb 2025US 2025/0066169 A1Fuzhou Skywiretech Co.,Ltd.
- Peeling apparatus23 Nov 2023US 2023/0373129 A1Disco Corporation
- Semiconductor chip manufacturing device and method of manufacturing semiconductor chips16 Dec 2021US 2021/0391684 A1Mitsubishi Electric Corporation
- Cold fluid semiconductor device release during pick and place operations, and associated systems and methods22 Jul 2021US 2021/0225672 A1Micron Technology, Inc.
- Planarization process, apparatus and method of manufacturing an article18 Feb 2021US 2021/0050218 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Wafer method for breaking a semiconductor54US 5,527,744 ATexas Instruments Incorporated · 1996
- Integrated partial sawing process26US 5,393,706 ATexas Instruments Incorporated · 1995
- Method and apparatus for assembling semiconductor devices such as LEDs or optodetectors17US 4,590,667 AGeneral Instrument Corporation · 1986
- Method and apparatus for breaking and separating dies from a wafer14US 5,710,065 ATexas Instruments Incorporated · 1998
- Apparatus for breaking and separating dies from a wafer13US 5,979,728 ATexas Instruments Incorporated · 1999