B28D 5/0047
Using fluid or gas pressure
Official title: {using fluid or gas pressure}
B28D5/0047 (Using fluid or gas pressure) appears on 9 US grants and 8 published applications in this corpus.
Search patents in B28D- Granted patents
- 9
- Published applications
- 8
- Assignees
- 9
- Inventors
- 31
- Latest grant
- 30 Apr 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 2 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Semiconductor chip manufacturing device and method of manufacturing semiconductor chips30 Apr 2024US 11,973,309 B2Mitsubishi Electric Corporation
- Processing apparatus including a water collection pan4 Jul 2023US 11,691,313 B2Disco Corporation
- Planarization process, apparatus and method of manufacturing an article15 Jun 2021US 11,034,057 B2Canon Kabushiki Kaisha
- Material sheet handling system and processing methods10 Sep 2013US 8,528,886 B2Corning Incorporated
- Automated dicing tool for semiconductor substrate materials14 Jul 2009US 7,559,446 B2International Business Machines Corporation
- Peeling apparatus23 Nov 2023US 2023/0373129 A1Disco Corporation
- Semiconductor chip manufacturing device and method of manufacturing semiconductor chips16 Dec 2021US 2021/0391684 A1Mitsubishi Electric Corporation
- Planarization process, apparatus and method of manufacturing an article18 Feb 2021US 2021/0050218 A1Canon Kabushiki Kaisha
- Processing apparatus30 Jul 2020US 2020/0238570 A1Disco Corporation
- Separating device for the chip-free cutting of wafers of donor substrates11 Jan 2018US 2018/0009130 A1Siltectra GmbH
Most cited
By later US patents
- Wafer method for breaking a semiconductor54US 5,527,744 ATexas Instruments Incorporated · 1996
- Integrated partial sawing process26US 5,393,706 ATexas Instruments Incorporated · 1995
- Method and apparatus for cleaving semiconductor material10US 6,017,804 ALucent Technologies Inc. · 2000
- Processing apparatus including a water collection pan1US 11,691,313 B2Disco Corporation · 2023
- Automated dicing tool for semiconductor substrate materials1US 7,559,446 B2International Business Machines Corporation · 2009