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US 6,017,804 AGranted
Method and apparatus for cleaving semiconductor material
AssigneeLucent Technologies Inc.
InventorsJoseph Michael Freund, George John Przybylek, Dennis Mark Romero, John William Stayt, Jr.
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Abstract
The invention disclosed is a method and apparatus for cleaving semiconductor material without physical contact. Tick marks are formed in a major surface of the material where cleaving is desired. A fulcrum member is moved with respect to the material until a tick mark is in alignment with the fulcrum member. A gas jet, also aligned with the fulcrum member, is applied to the surface of the material to form the cleave.
Claims5
A method for cleaving semiconductor material having opposite major surfaces comprising the steps of:
- forming tick marks in one major surface of the material where cleaving is desired;
- mounting the material on a surface of a flexible film;
- positioning the material so that one of the tick marks is vertically aligned with a fulcrum member which is in close proximity to the opposite surface of the film;
- and
- applying a gas jet to the one surface including the tick marks so that pressure from the jet forms a cleave at the tick mark.
2 more elements
Dependencies are inferred from the claim text.