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US 11,034,057 B2Granted
Planarization process, apparatus and method of manufacturing an article
AssigneeCanon Kabushiki Kaisha
InventorsOzkan Ozturk, Seth J. Bamesberger, Masaki Saito, Alireza Aghili, Steven C. Shackleton, Byung-Jin Choi
Life of this patent
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Abstract
A method is provided, comprising creating at least one crack at a point on an edge of a stack of at least a substrate and a superstrate; propagating the crack along the periphery; and moving the superstrate relative to the substrate to complete separation of the superstrate from the substrate.
Claims22
A method, comprising:
- creating at least one crack at a point on an edge of a stack of at least a substrate and a superstrate for initiating separation between the substrate and the superstrate;
- propagating the crack along the periphery;
- and
- moving the superstrate relative to the substrate to complete separation of the superstrate from the substrate.
1 more element
A chucking system, comprising:
- a superstrate chuck configured to retain a superstrate with negative fluid pressure;
- and
- a source of force configured to apply a force to a point on an edge of the superstrate stacked with a substrate, so as to create a crack between the substrate and the superstrate at the point on the edge for initiating separation between the substrate and the superstrate.
A method of manufacturing an article, comprising:
- forming a cured material stacked between a substrate and a superstrate;
- creating at least one crack at a point at an edge between a substrate and a superstrate for initiating separation between the substrate and the superstrate;
- propagating the crack along the periphery;
- and
- separating the superstrate from the cured material.
2 more elements
Dependencies are inferred from the claim text.