Semiconductor chip manufacturing device and method of manufacturing semiconductor chips

A semiconductor chip manufacturing device which produces a plurality of laser-diode chips by dividing a semiconductor wafer on which a visually identifiable block line is formed in advance and also on which a scribed line is inscribed so that a microcrack is formed along the scribed line, the semiconductor chip manufacturing device, comprising:

• a casing inside of which gaseous fluid is caused to flow in a fluid medium filling in the case along the scribed line;
• a blade cutting-edge for pressurizing a surface of the semiconductor wafer along a crack portion made of the block line of the semiconductor wafer or the scribed line thereof;
• and
• a reception stage including two portions separated from each other for supporting the semiconductor wafer on a surface on an opposite side to a surface where the blade cutting-edge pressurizes the semiconductor wafer, wherein
• the semiconductor wafer is divided into a plurality of laser-diode chips by pressurizing, by means of the blade cutting-edge, the semiconductor wafer along a crack portion thereof in the fluid medium in a region of the wafer opposite to a region between the separated two portions of the reception stage.