Separating device for the chip-free cutting of wafers of donor substrates
AssigneeSiltectra GmbH
InventorJan Richter
Life of this patent
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Abstract
The present invention relates to a device (1) for separating at least one wafer from a donor substrate (2). The device (1) according to the invention comprises at least a housing (4) with a receiving space (6) for receiving at least one multi-layer arrangement (8) which consists of at least one donor substrate (2) and a receiving layer (10) arranged or generated thereon, and an application device (12) for the contactless application of the multi-layer arrangement (8) for generating crack-conducting stresses in the multi-layer arrangement (8).
Claims9
Device (1) for cutting of at least one solid body portion, in particular a wafer, from a donor substrate (2), in particular an ingot,
- at least comprising
- a housing (4) with a receiving space (6) for receiving at least one multi-layer arrangement (8), consisting of at least one donor substrate (2) and one receiving layer (10) arranged or generated thereon, and
- an application device (12) for the contactless application of the multi-layer arrangement (8) for generating crack conducting stresses in the multi-layer arrangement (8).
Device according to any one of the preceding claims,
- characterised in that
- the application device (12) is designed to introduce a fluid substance into the receiving space (6), wherein the temperature of at least a part of the multi-layer arrangement (8), particularly the receiving layer (10), can be controlled by means of the fluid substance in such manner that the crack initiating stresses and/or the crack conducting stresses are generated in the donor substrate (2) via the receiving layer (10),
- wherein the receiving layer has a coefficient of thermal expansion that differs from the coefficient of thermal expansion of the donor substrate (2) by at least an order of magnitude,
- wherein stresses are created in the solid body (2) by the thermal shocking of the receiving layer (10) in such manner that the stresses lead to a crack in the solid body (2) along a separation area, by which the solid body portion is separated from the solid body (2).
Device according to any one of the preceding claims,
- characterised in that
- the application device (12) includes a plurality of feed means (16, 18, 20) for feeding the fluid substance, in particular liquid nitrogen, wherein the fluid substance can be sprayed into the receiving space (6) in the form of a mist through at least one of the feed means (16, 18, 20), wherein preferably at least one of the feed means (20) is configured or operable in such manner that a crack initiation can be caused be means of said feed means (20),
- wherein die receiving layer has a coefficient of thermal expansion that differs from the coefficient of thermal expansion of the donor substrate (2) by at least one order of magnitude,
- wherein stresses are created in the solid body (2) by the thermal shock from the receiving layer (10) in such manner that the stresses initiate a crack in the solid body (2), by which the solid body portion is separated from the solid body (2).
Device according to any one of the preceding claims,
- characterised in that
- the receiving space (6) is designed such that it can be evacuated, wherein preferably a pump device, particularly a vacuum pump (22) is provided, which forms an operative connection with the receiving space (6).
Device according to any one of the preceding claims,
- characterised in that
- a holding and/or homogenising device (24) is arranged in the receiving space (6) for holding and/or homogenising the fluid substance which is introduced into the receiving space (6), wherein the holding and/or homogenising device (24) is preferably tubular, particularly annular in shape.
Device according to any one of the preceding claims,
- characterised in that
- a heating device (26) for controlling the temperature of the donor substrate (2) is arranged in the receiving space (6) or on the housing (4), wherein heating of the donor substrate (2) preferably from a temperature below 0° C., in particular below −50° C. or below −100° C. or below −150° C., to room temperature can be effected by the heating device (26).
Device according to any one of the preceding claims,
- characterised in that
- a spring-mounted or damped catching device (28) is arranged in the receiving space (6) for springy or damped catching of the separated solid body portion, wherein the spring-mounted or damped catching device (28) is preferably arranged on the holding and/or homogenising device (24).
Dependencies are inferred from the claim text.