Method and apparatus for assembling semiconductor devices such as LEDs or optodetectors
AssigneeGeneral Instrument Corporation
InventorRalph E. Simon
Life of this patent
Estimating the term…
Abstract
A wafer divided into rows of abutted end-to-end dice (i.e., semiconductor chips) is placed on a thin, non-elastic membrane and drawn tightly over a knife-edge to successively separate each row of dice from the membrane. The dice are then attached to individual leadframes directly or are picked up by a vacuum fixture and carried to a position where they are secured to the leadframes and are wire bonded. After bonding, the components are assembled into finished subassemblies. In one embodiment, LED lamps are fabricated. A reflector is secured to each leadframe over the die positioned thereon, and the leadframe, die and reflector are molded into a lamp subassembly, which is used to form a larger lamp or display fixture.
Claims13
A method for mass producing semiconductor devices comprising the steps of:
- providing a thin, non-stretchable membrane,
- mounting a wafer containing multiple semiconductor components to said membrane,
- dividing said wafer into a plurality of dice arranged in an abutted end-to-end relationship in a plurality of parallel rows,
- disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge,
- transferring a row of said dice removed from said membrane by the knife-edge to a position in alignment with a corresponding row of leadframe members, and then
- simultaneously attaching each individual die in said removed row of dice to the leadframe member corresponding thereto in the row of leadframe members.
A method for separating dice from a wafer to form semiconductor devices comprising the steps of:
- providing a thin, non-stretchable membrane,
- mounting a wafer containing multiple semiconductor components on said membrane,
- dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows,
- disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and
- removing a row of said dice from said membrane with a vacuum pick up tool having a lip that engages an edge of each die and pushes said row of dice away from said knife-edge, thereby sliding the row off the membrane.
A method for separating dice from a wafer to form semiconductor devices comprising the steps of:
- providing a thin, non-stretchable membrane,
- mounting a wafer containing multiple semiconductor components on said membrane,
- dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows,
- disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and
- removing a row of said dice from said membrane with a picker bar mounted adjacent and just above said membrane immediately downstream of said knife-edge in the direction of membrane travel.
A method for separating dice from a wafer to form semiconductor devices comprising the steps of:
- providing a thin, non-stretchable membrane,
- mounting a wafer containing multiple semiconductor components on said membrane using an ultraviolet sensitive adhesive,
- dividing said wafer on said membrane into a plurality of dice arranged in an abutted end-to-end relationshop in a plurality of parallel rows,
- disposing said membrane over a knife-edge to sequentially remove a portion of each die in each row simultaneously from said membrane as it passes over said knife-edge, and
- flashing an ultraviolet light at said knife-edge as said membrane is passed over the knife-edge to sequentially loosen a row of dice.
Dependencies are inferred from the claim text.