Cold fluid semiconductor device release during pick and place operations, and associated systems and methods

A method for handling semiconductor dies, comprising:

• flowing a cold fluid into a cooling structure positioned around a vacuum pick head of a picking device to loosen a bond between a support substrate and a singulated semiconductor die releasably attached to the support substrate;
• engaging the pick head with the singulated semiconductor die;
• moving an ejector pin of an ejector device into contact with a lower surface of the support substrate to elevate at least a portion of the singulated semiconductor die;
• and
• removing the singulated semiconductor die from the support substrate with the pick head.

A system for handling semiconductor dies, comprising:

• a support member positioned to carry a semiconductor wafer, the semiconductor wafer having a plurality of semiconductor dies releasably attached to a dicing tape carried by a dicing frame;
• a picking device having a vacuum pick head, the pick head positioned above the semiconductor wafer and configured to pick individual ones of the semiconductor dies at a pick station;
• an ejector device positioned below the semiconductor wafer at the pick station and having at least one ejector pin configured to move upwardly to contact a portion of the dicing tape at the pick station to elevate an individual semiconductor die attached to the portion of the dicing tape at the pick station relative to neighboring ones of the semiconductor dies;
• a cooling structure positioned around the pick head;
• and
• a cold fluid source configured to flow a cold fluid into the cooling structure to cool the portion of the dicing tape and/or the individual semiconductor die at the pick station.