B28D 5/0076
For removing dust
Official title: {for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work}
B28D5/0076 (For removing dust) appears on 142 US grants and 180 published applications in this corpus.
Search patents in B28D- Granted patents
- 142
- Published applications
- 180
- Assignees
- 95
- Inventors
- 438
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 1 |
| 2002 | 10 | 10 |
| 2003 | 6 | 6 |
| 2004 | 5 | 6 |
| 2005 | 6 | 4 |
| 2006 | 4 | 1 |
| 2007 | 3 | 5 |
| 2008 | 0 | 3 |
| 2009 | 4 | 4 |
| 2010 | 2 | 8 |
| 2011 | 5 | 10 |
| 2012 | 1 | 21 |
| 2013 | 6 | 10 |
| 2014 | 6 | 5 |
| 2015 | 4 | 5 |
| 2016 | 7 | 4 |
| 2017 | 3 | 5 |
| 2018 | 3 | 11 |
| 2019 | 7 | 9 |
| 2020 | 6 | 9 |
| 2021 | 8 | 6 |
| 2022 | 5 | 4 |
| 2023 | 2 | 13 |
| 2024 | 7 | 6 |
| 2025 | 9 | 10 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods for controlling wafer breakage during ingot slicing operations21 Apr 2026US 12,605,863 B2GlobalWafers Co., Ltd.
- Method for removing silicon powder in coolant for monocrystalline silicon slicing with diamond wire10 Mar 2026US 12,569,784 B2Tcl Zhonghuan Renewable Energy Technology Co., Ltd.
- Cleaning device for net monitor and slicer10 Mar 2026US 12,569,888 B2Tcl Zhonghuan Renewable Energy Technology Co., Ltd.
- Under-wire spray cleaning device for wire cutting machine10 Mar 2026US 12,570,024 B2Tcl Zhonghuan Renewable Energy Technology Co., Ltd.
- System for cooling a cutting wire3 Mar 2026US 12,564,892 B2SMO bvba
- Method for simultaneously slicing a multiplicity of slices from a workpiece by means of a wire saw1 Oct 2026US 2026/0295901 A1
- Water supply device for blade18 Jun 2026US 2026/0168510 A1Mikasa Sangyo Co., Ltd.
- Silicon Rod Cutting System7 May 2026US 2026/0124789 A1Qingdao Gaoce Technology Co., Ltd
- Fancy concave cutting gemstone faceting attachment device23 Apr 2026US 2026/0109081 A1
- Filter Device for Cutting Fluid, Cleaning Method for Filter Device, and Filter Circulation System27 Nov 2025US 2025/0360441 A1Qingdao Gaoce Technology Co., Ltd
Most cited
By later US patents
- Laser cutting apparatus and method154US 6,407,360 B1Samsung Electronics Co., Ltd. · 2002
- Grinding method69US 4,016,855 AHitachi, Ltd. · 1977
- Cleaning apparatus65US 6,386,466 B1Disco Corporation · 2002
- Wafer processing system45US 5,950,643 A1999
- Laser cutter apparatus using two laser beams of different wavelengths31US 6,590,181 B2Samsung Electronics Co., Ltd. · 2003