Wafer processing system

A system for processing wafers formed by slicing a cylindrical workpiece that is adhered to a support plate by an adhesive agent, said system comprising:

• washing station for washing the wafers while the wafers are adhered to the support plate;
• removing station for separating the wafers from the support plate, the separated wafers being retained in a cylindrically shaped group;
• and
• separating station for separating the wafers one by one, the separating station including a vessel for accommodating the wafers separated one from another.

A system for processing wafers, wherein wafers are formed by slicing a cylindrical workpiece adhered to a support plate with an adhesive agent so that the wafers remain adhered to the support plate in a cylindrical form, the system comprising:

• a washing apparatus washing the wafers while the wafers are adhered to the support plate;
• a conveyer transferring the washed wafers, wherein the washed wafers are adhered to the support plate;
• and
• a separating apparatus separating the wafers that are retained in a cylindrically shaped group from the support plate, wherein the wafers are transferred from the washing apparatus by the conveyer.

A method for processing wafers formed by slicing a cylindrical workpiece that is adhered to a support plate by an adhesive, the method comprising:

• washing the wafers while the wafers are adhered to the support plate;
• separating the wafers from the support plate, the separated wafers being retained in a cylindrically shaped group;
• and
• transferring the washed wafers from the washing means to the removing means while the washed wafers are adhered to the support plate.