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US 6,590,181 B2Granted
Laser cutter apparatus using two laser beams of different wavelengths
AssigneeSamsung Electronics Co., Ltd.
InventorsDae-ho Choo, Byeong-ill Kim, Sung-uk Jung, Woo-shik Lee, Bum-soo Kim
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Abstract
The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.
Claims11
A laser cutter comprising:
- a laser unit for irradiating a first laser beam with a first wavelength along a marked cutting line of an object being cut;
- light modulation means for modulating a part of said first laser beam into a second laser beam having a second wavelength and for transmitting the remainder of said first laser beam, wherein said second laser beam is irradiated onto said marked cutting line, following said first laser beam;
- and
- means for cooling the cutting line which said first laser beam has been irradiated.
1 more element
Dependencies are inferred from the claim text.